MEMS pressure sensor

Abstract

The invention provides an MEMS pressure sensor. The MEMS pressure sensor comprises a circuit board, a shell, an MEMS pressure sensor chip and an ASIC chip, wherein the shell and the circuit board are assembled to form containing space, and the MEMS pressure sensor chip and the ASIC chip are installed on the circuit board. An air hole is formed in the shell. The circuit board comprises an installing area where at least one chip is installed and a non-installing area surrounding the installing area. An annular groove surrounding the installing area is formed in the non-installing area. As the groove is formed in the periphery of the area, where the MEMS chip and / or the ASIC chip are / is installed, of a substrate, the function of buffering pressure is achieved, it is avoided that external stress directly acts on the MEMS pressure sensor chip and / or the ASIC chip, and influences of external force impacting on the measurement accuracy of the sensor are further reduced.

Description

【Technical Field】 [0001] The invention relates to a pressure sensor, in particular to a MEMS pressure sensor. 【Background technique】 [0002] With the rapid development of science and technology, intelligent portable electronic devices have gradually become popular, such as smart phones, smart bracelets, smart hands, and tablet computers. While continuously pursuing the intelligentization of portable electronic devices, users pay more attention to the need for portable electronic devices to have a rich and colorful user experience. At present, more and more manufacturers place pressure sensors in portable electronic devices, and the pressure sensors are usually strain sensors, but the measurement accuracy of the strain sensors is low. [0003] The MEMS pressure sensor provided in the prior art includes a circuit board, a housing that cooperates with the circuit board to form an accommodation space, and a MEMS pressure sensor chip and an ASIC chip accommodated in the accommodation ...

AI Technical Summary

Problems solved by technology

However, MEMS pressure sensor chips and ASIC chips are generally mounted directly on circuit boards, which greatly affects the measurement accuracy of the chips when they are impacted by external forces.

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