Selective electroless gold plating process for printed circuit boards

A printed circuit board, selective technology, applied in the field of PCB board manufacturing, can solve the problems of high cost, complex gold plating process, thick gold layer deposition, etc., achieve good promotion value, reduce gold plating area, and process operation convenient effect

Inactive Publication Date: 2015-12-09
XINFENG FUCHANGFA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is to overcome the defects of nickel-gold deposition on the entire board of the PCB board in the prior art, too thick gold layer deposition, too much area and complicated gold-chemical process, and provide A Selective Gold Process for Printed Circuit Boards with Reduced Manufacturing Operational Costs

Method used

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Embodiment Construction

[0025] Preferred embodiments of the present invention are described below, and it should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0026] A kind of printed circuit board selective gold process, comprises the following steps:

[0027] 1) Make a screen and design the screen graphic, which is more than 3mil larger than the original graphic.

[0028] 2) Ink screen printing on the first side of the PCB;

[0029] After accurately aligning the prepared screen with the alignment hole of the PCB to be printed, place the PCB on the character printing machine, and use TPBKM2 ink and a screen with a mesh number of 77T to screen the ink on the first side of the PCB Printing; screen printing speed: 3 ~ 4m / min, the amount of diluent added to TPBKM2 ink for each printing is not more than 4% by volume, and the mesh size and number of holes of the mesh are sui...

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PUM

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Abstract

The invention discloses a selective electroless gold plating process for printed circuit boards, including the following steps: (1) making a screen printing board; (2) screen-printing a first side of a PCB with ink; (3) baking the board; (4) screen-printing a second side of a PCB with ink; (5) baking the board; (6) electroless gold plating; and (7) stripping a film. According to the process, TPBKM2 ink is used to replace dry film or blue gel widely employed in the industry today, and ink screen-printing is adopted to selectively cover the sides of the board, thereby reducing the area of electroless gold plating and lowering the cost. Ink causes less pollution to a gold nickel urn. Film stripping is easy. A lot of manpower and material resources can be saved, and the production cost can be lowered. The process needs no artificial alignment, exposure, development, or other cumbersome steps. Operation is convenient, and the production is low. Selective covering of a PCB with small pad clearance is easy to realize. The process is highly operable, and has good promotion value in production and application of selective electroless gold-plated PCBs.

Description

technical field [0001] The invention relates to the manufacturing field of PCB boards, in particular to a process for selectively goldizing printed circuit boards. Background technique [0002] In the PCB board manufacturing industry, in order to ensure that the pads (PAD) or lines on the PCB have good solderability, conductivity and oxidation resistance, it is often required to plate gold or nickel and other precious metals on the surface of the PAD or lines. [0003] There are usually two processes in the industry: one is electroplating, that is, the PCB board is used as a cathode, and gold ions are discharged on the surface of the PCB board under the action of direct current to form a gold electroplating layer; the second is chemical gold plating, that is, chemical gold plating. The PCB board of this process does not need an external power supply, and only relies on the chemical reduction reaction of the plating solution, so that the metal ions are continuously reduced on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/24
CPCH05K3/243H05K3/241H05K2203/072
Inventor 张惠琳
Owner XINFENG FUCHANGFA ELECTRONICS
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