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Universal loading device for gold wire bonding

A loading device and gold wire bonding technology, which is applied in the direction of auxiliary devices, metal processing equipment, auxiliary welding equipment, etc., can solve the problems of occupying the use time of the bonding table, achieve improved bonding efficiency, convenient and fast clamping, and save to wait for the effect of the warm-up time

Active Publication Date: 2015-12-09
GUANGXUN SCI & TECH WUHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is: greatly improve the efficiency of gold wire bonding, solve the problem that each device needs to wait for preheating for gold wire bonding, and occupy the use time of the bonding table

Method used

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  • Universal loading device for gold wire bonding
  • Universal loading device for gold wire bonding
  • Universal loading device for gold wire bonding

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Embodiment Construction

[0058] How the present invention is realized is further described below in conjunction with the accompanying drawings.

[0059] Such as figure 1 As shown, it is a common chip, and the chip base 1-1 and the chip 1-2 have been mounted as one;

[0060] The current way of fixing and operating the gold wire bonding loading plate, such as figure 2 As shown, it includes: a pressing block 5 , a loading tray 6 , and a heating chassis 7 of a bonding station. Operation method: press the pressing block 5, clamp a single chip in the fixing groove of the device loading tray 6, loosen the pressing block 5, and fix the chip. Wait for the chip to preheat, and after preheating, the rivet 4 performs gold wire bonding to complete the bonding. Press the compression block 5, take out the chip and put it into the turntable. Repeating the above steps, one by one for clamping, preheating, bonding, and clamping operations, is inefficient.

[0061] The specific fixation and operation mode of the g...

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Abstract

The invention provides a universal loading device for gold wire bonding. The universal loading device comprises a loading plate component and a heating platform component, wherein the loading plate component comprises a loading plate (7), limiting pieces (8), a lifting handle (9), compression blocks (10), springs (11), shafts (12), chip components (13) and locating pin holes (15); the heating platform component comprises a locating plate (16) and locating pins (17). According to the universal loading device for gold wire bonding, provided by the invention, the loading plate and a heating base plate are designed to be separated, therefore one set of gold wire bonding equipment can be matched with a plurality of sets of loading plates, the utilization of the golden wire bonding equipment can be maximized; besides, after devices to be bonded are loaded onto the loading plate for clamping, unclamping is carried out only after processes such as whole plate bonding, whole plate turning and whole plate ageing are completed, clamping and unclamping operations of each of the devices during bonding and ageing can be avoided, and the working efficiency is greatly improved.

Description

technical field [0001] The invention belongs to the field of design and manufacture of optical communication devices, and relates to a clamping and loading device for gold wire bonding, in particular to a general turnover device for clamping gold wire bonding devices. Background technique [0002] Gold wire bonding is widely used in optical communication systems, optical information processing systems, and optical instruments and meters. It is used for the welding of gold wires between chips and components or the welding of gold wires in integrated circuits. Clamp and fix the devices to be bonded on the bonding table. Below the bonding surface is a heating device to heat chips and other devices. After heating, gold wire bonding is performed. The gold wire welding has high strength and good reliability. The current bonding device is placed individually when assembling chips and other devices, and there is only one device fixing slot. After the chip device is clamped and fixe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K37/00
CPCB23K37/00
Inventor 黄杰丛江毅全本庆庞德银
Owner GUANGXUN SCI & TECH WUHAN
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