A solder ball pump head for laser soldering
A tin ball and laser technology, applied in tin feeding devices, welding equipment, metal processing equipment, etc., can solve the problems of large frictional resistance and difficult to achieve, and achieve the effect of low manufacturing cost, guaranteeing reliability, and improving the speed of ball ejection.
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[0040] The technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention.
[0041] Please refer to Figure 2-4 , the present invention provides a solder ball pump head for laser soldering. The solder ball pump head for laser soldering includes an outer sleeve 18, a solder ball bucket 28 installed on the outer sleeve 18, and a The rotor 20 in the sleeve 18 and the motor 15 that drives the rotor 20 to rotate.
[0042] An air gap 28-A having a width smaller than the diameter of the solder ball and communicating with the inner cavity of the solder ball bucket 28 is provided between the bottom of the solder ball bucket 28 and the outer sleeve 18, and the air gap 28-A is used for introducing protective gas. The air gap 28-A is set in such a way that the shielding gas enters the solder ball barrel 28 and at the same time prevents the solder balls in the solder ball barrel 28 from ent...
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