Printed circuit board with blind holes and processing method of printed circuit board

Abstract

The invention discloses a printed circuit board with blind holes and a processing method of the printed circuit board. The printed circuit board comprises an upper copper foil layer, a base material layer, an epoxy resin glue film layer and a copper foil layer for foiling, wherein the upper copper foil layer is arranged on the upper surface of the base material layer; the epoxy resin glue film layer is arranged on the lower surface of the base material layer; the copper foil layer for foiling is arranged on the lower surface of the epoxy resin glue film layer; and blind holes are formed in the upper copper foil layer, the base material layer and the epoxy resin glue film layer. According to the printed circuit board, the diameters and the depths of the blind holes can be arbitrarily combined; the diameters can be realized by selecting the size of a drill pin; the depths can be realized by selecting printed circuit substrates with different thicknesses; the printed circuit board is free of a glue residue, upright in hole pattern, simple in design and easy to process; and the design of the product has large extension, so that the functional diversity of the product can be realized.

Description

technical field [0001] The invention discloses a printed circuit board with blind holes, and also discloses a processing method for the printed circuit board with blind holes. Background technique [0002] With the rapid development of electronic products, many special products correspond to special needs. The traditional blind hole design is difficult to meet some special needs, such as: buried components and acoustic cavity requirements. If the traditional blind hole laser method is used to make blind holes , the general diameter is 75~150um, and the depth is 30~100um. If you need to make a large blind hole or a deeper blind hole, you need to spend longer laser time and greater laser energy to work, which will cause laser shooting. Problems such as wear, slag residue, and abnormal hole shape cannot meet the customer's product function and reliability needs. Contents of the invention [0003] The object of the present invention is to overcome the disadvantages of the pri...

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Problems solved by technology

[0002] With the rapid development of electronic products, many special products correspond to special needs. The traditional blind hole design is difficult to meet some special needs, such as: buried components and acoustic cavity requirements. If the traditional blind hole laser method is used to make blind holes , the general diameter is 75~150um, and the depth is 30~100um. If you need to make a large blind hole or a deeper blind hole, you need to spend longer laser time and greater laser energy to work, which will cause laser shooting. Problems such as wear, glue residue, and abnormal shape of the hole cannot meet the customer's product function and reliability requirements.

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