Active noise reduction controller

Abstract

The invention discloses an active noise reduction controller which comprises a substrate, a silicon microphone, an ASIC chip integrated through an ASIC technology, and a shell. The silicon microphone and the ASIC chip are fixed to the substrate and disposed in a closed space formed by the shell and the substrate, the silicon microphone and the ASIC chip are connected in a pressure welding manner through a first group of gold wires, and the ASIC chip and the substrate are connected in a pressure welding manner through a second group of gold wires. The substrate or the shell is provided with a sound hole in a position corresponding to the silicon microphone. The substrate is further provided with a lead bonding pad comprising an earphone unit positive end bonding pad, an earphone unit negative end bonding pad, a power input end bonding pad, an audio input end bonding pad and a common grounding end bonding pad, and the lead bonding pad is connected with the second group of gold wires through a printed circuit on the substrate.

Description

technical field [0001] The invention relates to the field of earphone noise reduction, in particular to an active noise reduction controller. Background technique [0002] Today, with the popularization of electronic products, earphones have become an indispensable daily necessities in people's lives. There are many types of earphones, such as in-ear type and head-mounted type, which are colorful and varied, but how to effectively reduce the influence of external noise is a common problem in improving the listening experience of earphones. Ordinary earphones block external noise by attenuating the sound wave energy transmitted in the air by the material properties of the earphones, but this method can usually play a better shielding effect on noise above a few thousand Hz, and for noise below a few hundred Hz. The blocking effect of low-frequency noise is still not ideal. The principle of active noise-cancelling headphones is to use the headphone unit to generate sound wav...

AI Technical Summary

Problems solved by technology

However, this kind of chip has many pins and needs to be soldered on the circuit board together with peripheral components. This circuit board will inevitably occupy a considerable part of the space in the earphone shell.

Because the remaining volume in the earphone shell is very small after the microphone is placed, it is difficult to accommodate the above-mentioned circuit without affecting the appearance of the earphone. Moreover, this SOC chip is realized by analog, and the parameter setting depends on external components and leads. Pin connection adjustment, the debugging process is cumbersome

In the realization of this solution, the assembly of the three parts of the microphone, circuit board and earphone unit in the small-volume case is complicated, occupying too much cavity volume and affecting the low-frequency characteristics of playback

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