Semiconductor processing device

Abstract

A semiconductor processing device, comprising a reaction chamber (201) and an air extraction chamber (207) which is arranged at the bottom of the reaction chamber, wherein an air exhaust port (202) is provided at the bottom of the reaction chamber, an air inlet port (207c) is provided at the top of the air extraction chamber correspondingly, and the air inlet port is connected to the air exhaust port; an air outlet port (207b) is provided on a side wall of the air extraction chamber for exhausting air in the air extraction chamber; a funnel-shaped conical ring (207a) is provided in the air extraction chamber and is located below the air outlet port, wherein a lower port of the conical ring is smaller than an upper port thereof; and the conical ring is used for dividing the air extraction chamber into an upper chamber and a lower chamber, wherein the upper chamber is in communication with the lower chamber through a ring hole of the conical ring. The semiconductor processing device can reduce the accumulation of some by-product granules carried in an airflow, and can restrain the accumulated by-product granules from being raised by the airflow, thereby preventing the by-product granules from returning to the reaction chamber.

Description

technical field [0001] The present invention relates to the technical field of semiconductor processing, in particular to a semiconductor processing equipment. Background technique [0002] Semiconductor processing equipment usually requires its reaction chamber to be in a vacuum state to ensure the stability of the process environment. Moreover, in the process of carrying out the process, it is necessary to continuously feed the process gas into the reaction chamber to react with the wafer, and at the same time, it is necessary to use the pumping system (including pumping pipes and vacuum pumps, etc.) to continuously pump the gas, so that The exhaust gas after the reaction is discharged out of the reaction chamber, thereby maintaining a certain degree of vacuum in the reaction chamber. In addition, for semiconductor processing equipment that only has a reaction chamber, it is also necessary to inflate the reaction chamber after the process is completed to return it to an a...

AI Technical Summary

Problems solved by technology

[0007] The above-mentioned pumping chamber inevitably has the following problems in practical applications, namely: figure 2 It can be seen that because the air flow encounters obstacles at the bottom corner of the pumping chamber 107 and forms a vortex, especially at the bottom corner opposite to the air outlet of the pumping chamber 107, a very large vortex and rebound flow will be formed, which will not only cause Part of the by-product particles carried in the gas flow accumulates at the bottom corner, and the vortex and rebound flow will also carry some of the by-product particles back to the reaction chamber 101, thus causing the reaction chamber 101 to be polluted

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