Electronic Package And Fabrication Method Thereof

Abstract

An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure provided on the substrate, wherein the antenna structure has at least a supporting portion and an extending portion supported by the supporting portion over the substrate and surrounding the electronic element; and a shielding structure provided on the substrate and overlapping with the antenna structure, thereby saving the surface area of the substrate so as to meet the miniaturization requirement of the electronic package.

Description

technical field [0001] The invention relates to an electronic package, especially an electronic package with an antenna structure. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. At present, wireless communication technology has been widely used in various consumer electronic products to receive or send various wireless signals. In order to meet the appearance design requirements of consumer electronic products, the manufacture and design of wireless communication modules are developed towards light, thin, short, and small requirements. Among them, the planar antenna (Patch Antenna) is small in size, light in weight, and easy to manufacture. It is widely used in wireless communication modules of electronic products such as cell phones and personal digital assistants (PDA). [0003] figure 1 It is a three-dimensional schematic diagram o...

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Problems solved by technology

[0004] However, in the existing wireless communication module 1, the antenna structure 12 is planar, so based on the electromagnetic radiation characteristics between the antenna structure 12 and the electronic component 11 and the volume limitation of the antenna structure 12, in the manufacturing process, the The antenna body 120 is difficult to integrate with the electronic component 11, that is, the packaging material 13 only covers the electronic component 11, but not the antenna body 120, so that the mold for the packaging process needs to correspond to the layout area of ​​these electronic components 11, and Does not correspond to the size of the substrate 10, which is not conducive to the packaging process

[0005] In addition, because the antenna structure 12 is planar, it is necessary to increase the layout area (the area where the encapsulation material 13 is not formed) on the surface of the substrate 10 to form the antenna body 120, which makes it difficult to reduce the width of the substrate 10, so it is difficult to Reduce the width of the wireless communication module 1, so that the wireless communication module 1 cannot meet the miniaturization requirements

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