A water-cooling heat dissipation device for 110kv thyristor valve body

Abstract

The invention relates to a water-cooling heat dissipation device for a 110kV thyristor valve body. The thyristor is a switching device provided with a semiconductor element. The water-cooling heat dissipation device includes a water inlet pipe and a water return pipe; A water inlet branch pipe connected to the water inlet pipe, a water distribution pipe provided with a heat dissipation component, and a return water branch pipe connected to the water return pipe are provided; the heat dissipation component is composed of heat dissipation elements connected in series and connected to the thyristor on both sides cuboid. The water-cooling heat dissipation device for a 110kV thyristor valve body provided by the invention has the advantages of simple structure, reasonable layout, and no bubble dead zone and rust corrosion.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a water cooling heat dissipation device for a 110kV thyristor valve body. Background technique [0002] At present, the voltage level of the widely used thyristor valve group is below 66kV, and the direct connection to the 110kV busbar SVC is a new research and development technology. Advanced equipment can reduce a lot of construction costs. The 110kV class SVC device thyristor valve needs to be equipped with a high-performance water cooling device due to its high voltage level and many layers in series. [0003] The inventor has found through long-term observation and analysis that there are generally the following problems in water-cooled heat dissipation devices: 1. The use of ordinary water pipes will naturally increase the length of the pipeline, resulting in an increase in the volume of the valve group and a complex structure; The way of parallel connection of waterways, this...

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Problems solved by technology

[0003] The inventor has found through long-term observation and analysis that there are generally the following problems in water-cooled heat dissipation devices: 1. The use of ordinary water pipes will naturally increase the length of the pipeline, resulting in an increase in the volume of the valve group and a complex structure; The way of parallel connection of waterways, this layout results in thinner water distribution pipes, large flow requirements, complex waterway connections of devices, large number of connection points, large processing volume and high cost, prone to leakage problems

3. There are many layers of thyristors, and there are many matching radiators. The original radiators are welded and cast, with low heat dissipation efficiency, difficult to clean inside, and prone to rust and corrosion, which will affect the water quality resistivity. In addition, they are installed with thyristors. inconvenient

4. The structure is easy to generate air bubbles to form a dead zone of gas blockage, which affects the level of partial discharge under high voltage conditions

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