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Serrated double-sided concave U sharp concrete laser welding cutting blade

A technology of laser welding and cutting discs, which is applied in the direction of abrasive materials, metal processing equipment, manufacturing tools, etc., can solve the problems of reduced load bearing capacity, loss of cutting ability, and decreased rigidity of the substrate to achieve small cutting deflection and good cutting sharpness , the effect of narrow slit

Active Publication Date: 2017-06-16
江苏华昌工具制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The diamond cutting blade is composed of two aspects: the diamond blade and the central substrate of the cutting disk. The thickness of the central substrate of the cutting disk determines the thickness of the diamond blade. The thicker the central substrate, the wider the slit when cutting, the lower the cutting efficiency and the greater the material loss. , the worse the economic benefit, the thinner the substrate, the thinner the cutter head, the improved cutting efficiency, and the reduced material loss; but the thinner substrate will lead to a decrease in the rigidity of the substrate itself, a reduction in the load-bearing capacity, and deflection during cutting, which will result in loss of cutting. ability

Method used

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  • Serrated double-sided concave U sharp concrete laser welding cutting blade
  • Serrated double-sided concave U sharp concrete laser welding cutting blade

Examples

Experimental program
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preparation example Construction

[0022] Concrete preparation process is as follows:

[0023] 1) Batching and granulation: According to the ratio, take atomized alloy powder, FCP alloy powder, copper powder, and nickel powder, add diamond, pre-mix to form a molding material, use a three-dimensional mixer to mix the material, and then use a manufacturing The molding material is obtained by granulating with a granulator, and the particle size is 50-200 μm.

[0024] 2) Cold pressing: adjust the tooling mold, put in the molding material and assemble it into the cold pressing forming steel mold for press molding to obtain the cutting sheet blank.

[0025] 3) Hot-press sintering: put the cut pieces into graphite molds, and carry out pressure sintering in a hot-press sintering press with a vacuum environment. The hot-press sintering temperature is about 800°C, and the unit pressure is 250-300kgf / cm 2 .

[0026] 4) The hot-pressed and sintered cutter head is deburred and arc-ground; together with the substrate, lase...

Embodiment 1

[0030] In this embodiment, the laser welding cutting sheet is prepared by the method of the present invention. Specifically, the cutting sheet of this embodiment is made of metal bond and diamond under vacuum conditions, sintered by hot pressing, and sintered The temperature is 800°C and the pressure is 280kgf / cm 2 . Wherein, the metal bonding agent is composed of 18wt% FCP alloy powder, 30wt% copper powder, 6wt% nickel powder, and the rest atomized alloy powder. The concentration of diamond is 1.1ct / cm 3 , wherein the volume of 35 / 40 is 30%, the volume of 40 / 45 is 40%, and the volume of 50 / 60 is 30%. The FCP alloy powder contains the following components by weight: 20wt% of Ni, 8wt% of W, 10wt% of Co, 1.0wt% of C, 1.0wt% of WC, and the rest of Fe; And the above components are obtained by performing mechanical alloying treatment in a ball mill for 180-200 hours, and the particle size is 20-50nm. The atomized alloy powder contains by weight: 20wt% tungsten carbide, 10wt% co...

Embodiment 2

[0032] In this embodiment, the laser welding cutting sheet is prepared by the method of the present invention. Specifically, the cutting sheet of this embodiment is made of metal bond and diamond under vacuum conditions, sintered by hot pressing, and sintered The temperature is 800°C and the pressure is 280kgf / cm 2 . Wherein, the metal bonding agent is composed of 20wt% FCP alloy powder, 25wt% copper powder, 8wt% nickel powder, and the rest atomized alloy powder. The concentration of diamond is 1.1ct / cm 3, wherein the volume of 35 / 40 is 30%, the volume of 40 / 45 is 40%, and the volume of 50 / 60 is 30%. The FCP alloy powder contains the following components by weight: 20wt% of Ni, 8wt% of W, 10wt% of Co, 1.0wt% of C, 1.0wt% of WC, and the rest of Fe; And the above components are obtained by performing mechanical alloying treatment in a ball mill for 180-200 hours, and the particle size is 20-50nm. The atomized alloy powder contains by weight: 20wt% tungsten carbide, 10wt% cob...

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Abstract

The invention relates to a saw-tooth double-faced concave U sharp type concrete laser welding cutting disk and belongs to the technical field of diamond machining tools. The cutting disk comprises a circular base body, a plurality of chip removing grooves extending inward from the side surface are formed in the base body, diamond tool bits are formed between the adjacent chip removing grooves, the diamond tool bits are provided with waved saw-tooth working faces and diamond cut surfaces formed from the saw-tooth working faces, and U-shaped notches are formed in the diamond cut surfaces. The saw-tooth double-faced concave U sharp type concrete laser welding cutting disk has the advantages that the cutting seam is narrow, the consumable items are less, the cutting deflection is small, the cut edge is neat, the cutting sharpness is good, and the cutting disk is particularly suitable for the cutting of hard materials including building materials, wall bodies, cement concrete, solidified concrete, reinforced concrete, hard concrete bricks, concrete piles and the like.

Description

technical field [0001] The invention relates to the technical field of superhard abrasive products, more specifically, the invention relates to a serrated double-sided concave U-sharp concrete laser welding cutting blade. Background technique [0002] In today's market, diamond cutting discs have been widely used in the cutting and processing of marble, granite, concrete, asphalt, ceramics, glass, jewelry and jade, semiconductors and other materials, continuously improving product efficiency and reducing material loss, especially in the processing of precious stone, jade and glass products When it comes to semiconductor materials, reducing material loss and improving economic benefits are the common pursuit of the market. The diamond cutting blade is composed of two aspects: the diamond blade and the central substrate of the cutting disk. The thickness of the central substrate of the cutting disk determines the thickness of the diamond blade. The thicker the central substrat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D5/12B24D5/10B24D3/10B22F3/14
CPCB22F3/14B24D3/10B24D5/10B24D5/12
Inventor 蒋武峰徐国栋
Owner 江苏华昌工具制造有限公司
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