A device and method for rapidly measuring surface infrared hemispheric emissivity
A technology for measuring surface and emissivity, applied in the direction of material thermal development, etc., can solve the problems of measurement accuracy, time-consuming, complex structure, etc., and achieve the effects of transient measurement signal-to-noise ratio, good stability, and simple structure
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[0021] The device of rapid measurement surface infrared hemispheric emissivity of the present invention, its preferred embodiment is:
[0022] It includes an outer cylinder, the upper end and the lower end of the outer cylinder are respectively provided with an upper support plate and a lower support plate, and a double-chamber main body is arranged in the space surrounded by the outer cylinder, the upper support plate and the lower support plate, and the double-chamber The upper end of the main body is fixed on the upper support plate, and the lower end of the double-cavity main body is inlaid with a fixed base;
[0023] The lower part of the lower support plate is fixed with a motor fixing cylinder, and a low-speed motor is fixed inside the motor fixing cylinder, and the output shaft of the low-speed motor is connected with the elongated shaft passing through the middle part of the double-cavity main body through a coupling, A modulation disc is connected to the upper end of...
specific Embodiment
[0050] figure 1 It is a structural block diagram of the present invention, including a temperature control module, a mechanical modulation module, a dual-cavity main body, a sensor module, a lock-in amplification module, a data processing and a display module.
[0051] The dual-cavity main body is the core of the device, specifically as figure 2 As shown, the temperature control module is used to heat the two thermal chambers 2 and 12 and maintain a constant temperature. The temperature control accuracy is 0.1°C, and the temperature control error is 0.5°C. The heating wire is wound on the outer surface of the thermal chamber, and the thermocouple is buried in the thermal chamber. Inside the openings 4 and 13. Before the actual measurement of the device, the temperature control module needs to be turned on first, and the thermal chamber is preheated so that the low-temperature thermal chamber is slightly higher than the ambient temperature, and the high-temperature thermal ch...
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