Prediction method of thermal fatigue life of BGA solder joints considering the influence of temperature cycle load sequence loading

A technology of fatigue life prediction and load sequence, which is applied in special data processing applications, instruments, electrical digital data processing, etc., can solve problems such as the lack of mature methods and limited research work, and achieve the effect of engineering application value

Active Publication Date: 2017-09-29
BEIHANG UNIV
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Problems solved by technology

However, for the most important thermal fatigue in solder joint fatigue, the existing life prediction model under the condition of temperature cycle cannot consider the influence of load sequence when the loading conditions change, and the application of Miner theory to linear accumulation results will have large errors, and the corresponding The research work is very limited, and there is no mature method for easy application

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  • Prediction method of thermal fatigue life of BGA solder joints considering the influence of temperature cycle load sequence loading
  • Prediction method of thermal fatigue life of BGA solder joints considering the influence of temperature cycle load sequence loading
  • Prediction method of thermal fatigue life of BGA solder joints considering the influence of temperature cycle load sequence loading

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Embodiment Construction

[0036] The BGA solder joint thermal fatigue life prediction method considering the impact of temperature cycle load sequence loading according to the present invention, see figure 1 As shown, the specific implementation steps of the method are as follows:

[0037] Step 1. According to the test data, the influence and reason of sequential loading of temperature cycle load on the thermal fatigue life of BGA solder joints are analyzed.

[0038] The influence of sequential loading of temperature cycle load on the thermal fatigue life of BGA solder joints is as follows: when the temperature cycle load is loaded sequentially from high to low, the fatigue life measured in the thermal fatigue test of BGA solder joints is shorter than the fatigue life predicted by Miner theory, while When the temperature cycle load is loaded sequentially from low to high, the fatigue life measured by the test is longer than that predicted by Miner's theory.

[0039] The reasons for the above effects a...

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Abstract

The invention discloses a method for predicting the thermal fatigue life of BGA solder joints considering the influence of sequential loading of temperature cycle loads, including 1. analyzing the influence and reason of sequential loading of temperature cycle loads on the thermal fatigue life of BGA solder joints; 2. according to the temperature cycle loads The influence of sequential loading on the thermal fatigue life of BGA solder joints and referring to the Paris formula to improve the Darveaux model, constructing a BGA solder joint thermal fatigue life prediction model considering the influence of sequential loading of temperature cycle loads; 3. Determine the influence of sequential loading of temperature cycle loads The fitting and determination method of each parameter in the thermal fatigue life prediction model of BGA solder joints; 4. The analysis and verification of the thermal fatigue life prediction model of BGA solder joints considering the influence of temperature cycle load sequence loading, and the Darveaux model under single temperature cycle load respectively The comparative analysis of the fatigue life prediction results, and the comparative analysis of the fatigue life prediction results of the Miner theory under the sequential loading of temperature cycles; 5. Complete the construction of the prediction method.

Description

technical field [0001] The invention relates to a method for predicting the thermal fatigue life of BGA solder joints considering the impact of sequential loading of different temperature cycle loads, and belongs to the technical field of failure physics. Background technique [0002] With the continuous development of electronic packaging technology, the field of application of electronic products is becoming more and more extensive, and the environmental conditions encountered in the use of electronic products are becoming more and more complex and harsh. There may be sudden changes in the environment, changes in working modes, etc., so that electronic products are loaded in sequence. under load conditions. BGA solder joints (ball grid array package solder joints) are a key link to ensure the reliability of electronic products, and the prediction and evaluation of their fatigue life is of great significance to products. However, for the most important thermal fatigue in s...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F19/00
Inventor 胡薇薇朱光远孙宇锋赵广燕陈浩
Owner BEIHANG UNIV
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