power semiconductor device

Abstract

The invention relates to a power semiconductor arrangement comprising a power semiconductor component, comprising a base body and comprising a plurality of capacitors, wherein the power semiconductor arrangement has a capacitor fastening device with an integral frame device which fits over the capacitor and One-piece clamping device, wherein the frame device has frame elements with elongated cutouts, wherein due to the cutouts, the frame elements each form a frame element finger, which laterally surrounds the corresponding capacitor, wherein the clamping The device has clamping elements which are placed over the frame element fingers and which each laterally surround the frame element fingers of the corresponding frame element. The invention provides a power semiconductor arrangement in which capacitors of the power semiconductor arrangement are fastened safely and reliably, wherein the fastening of the capacitors is economically achieved with little complexity.

Description

technical field [0001] The present invention relates to power semiconductor devices. Background technique [0002] In the case of power semiconductor devices known from the prior art, power semiconductor components such as power semiconductor switches and / or diodes are usually arranged on a substrate and are electrically conductive via conductor layers and bonding wires of the substrate and / or thin film composites connected to each other. Power semiconductor switches in this case are usually in the form of transistors, such as IGBTs (Insulated-Gate Bipolar Transistors) or MOSFETs (Metal-Oxide Semiconductor Field-Effect Transistors). )), or in the form of thyristors. [0003] Power semiconductor components are often electrically interconnected in this case to form single or multiple so-called half-bridge circuits, which are used, for example, to rectify and invert voltages and currents. In this case, the power semiconductor arrangement usually has capacitors connected elec...

AI Technical Summary

Problems solved by technology

As power semiconductors are constantly subjected to mechanical shock and / or vibration loads, mechanical failures of the electrical connection elements of the capacitors can occur, which leads to damage and failure of the power semiconductors

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