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Copper alloy frame material strip for etching and preparation method thereof

A frame material and copper alloy technology, which is applied in the field of copper alloy frame material strips for etching and its preparation, can solve the problems of electroplating, packaging and other processes that cannot be carried out smoothly, distortion, warping, etc., and achieve the reduction of residual internal stress and low The effect of simple cost and process

Active Publication Date: 2016-10-05
TAIYUAN JIN XI CHUNLEI COPPER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the high-strength strip product is etched downstream, due to the residual stress inside the strip, deformation phenomena such as twisting and warping often occur, resulting in subsequent electroplating, packaging and other processes that cannot be carried out smoothly

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Alloy composition: Ni2.3%, Si0.5%; Mg0.1%; Fe0.05%; Mn0.002%; Zn0.005%; Cu97.043%.

[0022] Add other components to the molten copper liquid, and after mixing uniformly, perform casting. The ingot is hot rolled at 950°C, and the strip (16mm) after rolling at 700°C is quenched at a cooling rate of 25°C / s.

[0023] Cold rolled to 2.5mm thickness for second phase precipitation strengthening annealing (530℃, 6h), then cold rolled to 1.0mm thickness for recrystallization annealing (480℃, 7h), and then cold rolled to preform thickness 0.4mm thickness annealing (450℃, 6h), the finished product is rolled to 0.127mm.

[0024] Perform tension correction (elongation rate 0.35%, tension in the tension correction zone 300N / mm 2 , Winding tension 40N / mm 2 ) Improve the plate shape, low-temperature heat treatment (temperature 400℃, time 25s), and at the same time, carry out surface cleaning treatment to obtain the finished strip.

Embodiment 2

[0026] Alloy composition: Ni3.2%, Si0.75%; Mg0.25%; Fe0.2%; Mn0.01%; Zn0.015%; Cu95.575%.

[0027] The other components are added to the molten copper liquid, and after the mixing is uniform, the casting is performed. The ingot is hot rolled at 950°C, and the strip (16mm) after rolling at 700°C is quenched at a cooling rate of 25°C / s.

[0028] Cold rolled to 2.5mm thickness for second phase precipitation strengthening annealing (530°C, 6h), then cold rolled to 1.0mm thickness for recrystallization annealing (480°C, 7h), and then cold rolled to a thickness of 0.4mm for pre-finished product thickness annealing (450℃, 6h), the finished product is rolled to 0.127mm.

[0029] Perform tension straightening (elongation rate 0.35%, tension in the tension straightening zone 300N / mm 2 , Winding tension 40N / mm 2 ) Improve the plate shape, low-temperature heat treatment (temperature 400℃, time 25s), and at the same time, carry out surface cleaning treatment to obtain the finished strip.

Embodiment 3

[0031] Alloy composition: Ni2.5%, Si0.55%; Mg0.08%; Fe0.1%; Mn0.005%; Zn0.008%; Cu96.757%.

[0032] The other components are added to the molten copper liquid, and after the mixing is uniform, the casting is performed. The ingot is hot rolled at 980°C, and the strip (16mm) after rolling at 720°C is quenched at a cooling rate of 25°C / s.

[0033] Cold rolled to 2.0mm thickness for second phase precipitation strengthening annealing (530°C, 6h), then cold rolled to 1.0mm thickness, recrystallization annealing (480°C, 7h), and then cold rolled to preform thickness 0.3mm thickness annealing (450℃, 6h), the finished product is rolled to 0.127mm.

[0034] Perform tension correction (elongation rate 0.35%, tension in the tension correction zone 300N / mm 2 , Winding tension 40N / mm 2 ) Improve the plate shape, low-temperature heat treatment (anneal temperature 400℃, time 30s), and at the same time, carry out surface cleaning treatment to obtain strip products.

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Abstract

The invention relates to a copper alloy frame material strip for etching, and the copper alloy frame material strip is low in residual internal stress; the strip is prepared from the following alloy components: 2.2-4.2% of Ni, 0.25-1.2% of Si, 0.05-0.30% of Mg, 0.01-0.2% of Fe, 0.002-0.01% of Mn, 0.005-0.015% of Zn and the balance of Cu; the strip is prepared by the following steps: uniformly mixing the alloy components and casting; performing hot-rolling, cooling and quenching on an ingot, wherein the initial hot-rolling temperature is 850-1000 DEG C, the final temperature is 700-800 DEG C, and a rolled strip blank is quenched at a cooling speed of 10-30 DEG C / s; and then carrying out annealing, straightening and withdrawing, and low-temperature heat treatment for three times so as to obtain a finished product. By selecting an appropriate alloy component proportion as well as processes of controlling hot-rolling, quenching temperature, aging heat treatment system, straightening and withdrawing as well as low-temperature heat treatment, the purpose of reducing the internal residual stress of the strip can be achieved.

Description

Technical field [0001] The invention relates to a new material, especially a copper alloy frame material strip for etching and a preparation method thereof. Background technique [0002] Copper alloy frame materials have high strength, high conductivity, low thermal expansion, plateability and excellent processing characteristics, and have huge market potential in the electronic fields such as integrated circuits and semiconductor components. With the development of large-scale integrated circuits and very large-scale integrated circuits, electronic packaging is developing in the direction of short, small, light and thin, and lead frames will develop in the direction of multiple leads and small pitch. Therefore, the etching forming processing method is more widely used. [0003] The frame material used for etching not only has high performance, but also requires polar residual stress. At present, the frame material strip for etching mainly adopts the production process of fusion ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/06C22F1/08
CPCC22C9/06C22F1/002C22F1/08
Inventor 陈清香张文芹张斌张晓敏樊华丽孟培一王全仁韩彩香朱永杰郑小英
Owner TAIYUAN JIN XI CHUNLEI COPPER CO LTD
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