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An Infrared Thermography Temperature Measurement Method with High Spatial Resolution and High Time Resolution

A high-spatial-resolution, infrared thermal imaging technology, applied in the field of temperature testing of semiconductor devices, can solve the problems of not being able to meet high-time-resolution temperature detection, underestimating peak temperature, etc. Effect

Active Publication Date: 2017-08-15
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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AI Technical Summary

Problems solved by technology

Existing transient infrared equipment and microscopic infrared thermal imaging cameras cannot meet the temperature detection requirements of high time resolution and high spatial resolution at the same time
When measuring the temperature of tiny structures with high-speed temperature changes, the true peak temperature will inevitably be underestimated

Method used

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  • An Infrared Thermography Temperature Measurement Method with High Spatial Resolution and High Time Resolution
  • An Infrared Thermography Temperature Measurement Method with High Spatial Resolution and High Time Resolution
  • An Infrared Thermography Temperature Measurement Method with High Spatial Resolution and High Time Resolution

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Embodiment Construction

[0036] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0037] Such as figure 1 As shown, a high spatial resolution and high time resolution infrared thermal imaging temperature measurement method includes the following steps:

[0038] (a) By adjusting the focus area of ​​the transient infrared device, use the transient infrared device to measure the temperature of the two regions of the tested object with significantly different temperatures. The region with significantly different temperatures refers to the temperature curve that should be able to clearly distinguish the two regions. The temperature in the area is generally not less than 10% of the maximum temperature, and two curves of temperature changing with time are obtained.

[0039] (b) Analyze the two temperature change curves to determine the time point when the DUT enters the quasi-steady state. Compare the two obtained temp...

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Abstract

The invention discloses an infrared thermal imaging temperature measurement method with high spatial resolution and high time resolution, which relates to the field of semiconductor device temperature testing; (a) by adjusting the focus area of ​​the transient infrared device, the transient infrared device is used to measure the Measure the temperature in two regions with significantly different temperatures, and obtain two curves of temperature change with time; (b) analyze the two temperature change curves, and judge the time point when the tested piece enters the quasi-steady state; (c) use transient infrared The equipment measures the temperature of the target area, and obtains the temperature change curve of the target area; (d) measures the temperature of the target area with a microscopic infrared thermal imager, and obtains the temperature distribution image of the target area; (e) obtains the temperature distribution image of the target area at any time and at any position exact temperature value. (f) Obtain the temperature distribution image of the entire area at any time point, and also obtain the temperature change curve in the entire time area at any position. The invention can satisfy temperature detection with high time resolution and high space resolution.

Description

technical field [0001] The invention relates to the technical field of temperature testing of semiconductor devices. Background technique [0002] Existing infrared temperature measurement equipment is mainly divided into two categories: spot temperature measurement and imaging temperature measurement. Spot temperature measurement infrared devices often use a separate detector, such as a single photodiode or thermopile, which has a high response speed and sampling speed, and can meet the detection requirements for rapidly changing temperature signals, such as transient (transient) infrared devices . Imaging infrared equipment generally adopts an area array detector, such as an array detector composed of multiple photosensitive diodes, which can meet the imaging test of the device under test and has better detail resolution, that is, spatial resolution, such as microscopic Infrared thermal imager. [0003] Existing transient infrared temperature measuring equipment can det...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01J5/00
Inventor 翟玉卫刘岩郑世棋吴爱华乔玉娥梁法国
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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