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A real-time test and analysis system for thin film electrical characteristics and breakdown characteristics

A technology for electrical properties and breakdown properties, applied in the field of real-time testing and analysis systems for thin-film electrical properties and breakdown properties, can solve the problems of unfavorable thin-film materials and device research and design, time-consuming and material resources, low research efficiency, etc. Reliable equipment system cost, less time-consuming, easy-to-operate effect

Inactive Publication Date: 2017-11-07
TONGJI UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This consumes a lot of time and material resources, and the research efficiency is low
At the same time, because the traditional breakdown test method is the result of statistical analysis of a large number of samples, but does not study the breakdown process, it is difficult to analyze and evaluate the breakdown mechanism of thin film materials and the reasons for the breakdown phenomenon. Very unfavorable to the research and design of thin film materials and devices

Method used

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  • A real-time test and analysis system for thin film electrical characteristics and breakdown characteristics
  • A real-time test and analysis system for thin film electrical characteristics and breakdown characteristics
  • A real-time test and analysis system for thin film electrical characteristics and breakdown characteristics

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Embodiment Construction

[0038] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. This embodiment is carried out on the premise of the technical solution of the present invention, and detailed implementation and specific operation process are given, but the protection scope of the present invention is not limited to the following embodiments.

[0039] A real-time test and analysis system for thin film electrical characteristics and breakdown characteristics, including an electrical test device, a real-time microscopic image acquisition device, and a comprehensive analysis and processing device, wherein the electrical test device is used to conduct electrical tests on samples; the microscopic image real-time acquisition device It is used for real-time collection and processing of microscopic image data of samples undergoing electrical testing; the comprehensive analysis and processing device is used for comprehensive analysis ...

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Abstract

The invention relates to a real-time test and analysis system for electrical properties and breakdown properties of thin films, which includes an electrical test device, a real-time microscopic image acquisition device and a comprehensive analysis and processing device, wherein the electrical test device includes a sample clamping seat, a test probe , a digital source meter and a test control module, the test probe is arranged on the sample clamping seat, and the test probe, the digital source meter and the test control module are connected in sequence; the microscopic image real-time acquisition device includes a connected A data code optical microscope module and an image acquisition module, the data code optical microscope module is arranged on the sample clamping seat; the comprehensive analysis and processing device is respectively connected to the test control module and the image acquisition module. Compared with the prior art, the present invention has the advantages of easy operation, less time-consuming, good intuitiveness, etc., and can effectively analyze and evaluate the breakdown mechanism of the thin film material and the cause of the breakdown phenomenon.

Description

technical field [0001] The invention relates to a performance testing technology of an insulating medium or a semiconductor thin film in the field of material science, in particular to a real-time testing and analysis system for the electrical characteristics and breakdown characteristics of a thin film. Background technique [0002] Breakdown testing is an important part of thin film semiconductor device or thin film capacitor research. However, the breakdown behavior of thin films under strong fields is extremely complex, and it is difficult to generalize. How to simply and effectively evaluate and analyze the breakdown phenomenon of thin films under strong field is an important research method to improve the research efficiency of thin film materials. Testing and analyzing the breakdown behavior of samples is a necessary means to improve its electrical resistance and reliability. [0003] For the breakdown behavior test research, the conventional method is to conduct br...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/00G01R31/12
Inventor 姚曼文陈建文邹培肖瑞华彭勇姚熹
Owner TONGJI UNIV
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