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A bonding device and bonding method for inclined butt joints

A technology for butt joints and bonding, which is applied in the direction of connecting components, material gluing, mechanical equipment, etc., can solve the problems of difficulty in precise control of the thickness of the adhesive layer, cannot be relatively far away, and it is difficult to accurately control the thickness of the adhesive layer, etc., to reduce bonding The risk of failure, the effect of saving investment and reducing the probability of scrap

Inactive Publication Date: 2016-11-02
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the adhesives used in the bonding technology have a certain degree of elasticity, and during the bonding process, the two bonded samples can only be relatively close but not relatively far away, which makes it difficult to accurately control the thickness of the adhesive layer.
Under the existing equipment, the thickness of the adhesive layer is generally measured after the samples are bonded, and it is difficult to accurately control the thickness of the adhesive layer

Method used

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  • A bonding device and bonding method for inclined butt joints
  • A bonding device and bonding method for inclined butt joints
  • A bonding device and bonding method for inclined butt joints

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] Such as figure 1 , figure 2 As shown, a bonding device for oblique butt joints of the present invention includes a base 1 , a fixing bead 2 , a top block 3 , a position measuring mechanism 4 , a driving mechanism 100 and a controller. As a preference, the base 1 is made of metal material. see also image 3 The base 1 is provided with a V-shaped positioning groove 5, and the first joint 6 and the second joint 7 to be bonded are placed in the V-shaped positioning groove 5. The V-shaped positioning groove 5 is arranged in two sections, and there is an operating space between them, so that the bonding part of the first joint 6 and the second joint 7 does not contact the base 1, which can prevent the glue from touching the base 1, thereby preventing the glue from touching the base 1. To protect the role of base 1. The fixed bead 2 is fixed on both sides of the V-shaped positioning groove 5 of the base by screws 8 , so that the middle of the fixed bead 2 is pressed again...

Embodiment 2

[0068] Compared with Embodiment 1, this embodiment adopts a different driving mechanism 100 . Such as Figure 9 As shown, in this embodiment, the driving mechanism 100 includes a tightening screw 24 and a rotary handle, the tightening screw 24 is installed on the right baffle 16 of the base, and is connected with the threaded hole on the right baffle 16 In cooperation, the left end of the tightening screw 24 is connected to the top block 3 , and turning the rotating handle can drive the top block 3 to move left and right so as to adjust the left and right positions of the second joint 6 .

[0069] The right end of tightening screw rod 24 is a positive prism, preferably a regular octagonal prism, and the rotating handle is connected with the right end of tightening screw rod 24, which is convenient to drive the tightening screw rod 24 to rotate.

[0070] As preferably, the rotary handle adopts a disc-shaped handle 25 or a rod-shaped handle 26, such as Figure 10 , Figure 11...

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Abstract

The invention provides a bonding device for a slope butt joint. The bonding device comprises a base, fixed pressing bars, a top block, a position measuring mechanism, a driving mechanism and a controller, wherein a V-shaped positioning groove is formed in the base; the fixed pressing bars are fixed on two sides of the V-shaped positioning groove of the base through screws; the top block is in contact with the non-bonding end of a second joint and pushes the second joint to approach to a first joint; the position measuring mechanism is used for measuring the position of the top block; the controller is used for controlling the driving mechanism to operate and drive the top block to move, so the space between the first joint and the second joint reaches the target distance. According to the bonding device disclosed by the invention, better generality is realized, and the bonding of slope butt joints with different angles can be realized; the driving mechanism has two different driving ratios, so the top block can be driven to move at different speeds; when the top block is close to the target distance, the top block is enabled to slowly move, the accurate target distance is reached, the non-retracement bonding is realized, the risk of bonding failure is reduced, and the probability that waste pieces are generated is reduced.

Description

technical field [0001] The invention relates to the technical field of bonding fixtures, in particular to a bonding device and a bonding method that can precisely control the thickness of the adhesive layer of a test piece bonded to a variety of inclined joints with different angles. Background technique [0002] Compared with traditional methods such as riveting, welding, and screwing, the bonding technology has a wide range of applications and is less affected by the type of material and the geometry of the bonding parts; the ratio of strength to mass is high, which is conducive to lightweight; shock absorption and Good impact resistance and other advantages have been used more and more in today's industrial production. According to the existing research, the connection strength of the adhesive sample is closely related to the thickness of the glue layer, so the control of the thickness of the glue layer is especially important for the application of the bonding technology...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F16B11/00
CPCF16B11/006
Inventor 那景新刘浩垒刘玉秦国锋陶士振蔡亮王童袁正白霜张师源
Owner JILIN UNIV
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