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Adhesive dispensing and curing mechanism movable in Z-axis direction

A Z-axis, dispensing technology, applied in the direction of material gluing, connecting components, mechanical equipment, etc., can solve the problems of small parts, low production efficiency, inaccurate positioning, etc., to improve production efficiency, convenient operation, and improve product quality. quality effect

Inactive Publication Date: 2015-04-29
BOZHON PRECISION IND TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the small size of small parts, positioning is relatively difficult, which is easy to cause worker fatigue, resulting in long production time and low production efficiency, and the small parts assembled on the product are prone to looseness, inaccurate positioning and other quality problems

Method used

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  • Adhesive dispensing and curing mechanism movable in Z-axis direction
  • Adhesive dispensing and curing mechanism movable in Z-axis direction
  • Adhesive dispensing and curing mechanism movable in Z-axis direction

Examples

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Embodiment Construction

[0032] Examples, see attached Figure 1-12 , a dispensing and curing mechanism movable in the Z-axis direction, which includes Z-axis mechanism Ⅰ, R-axis mechanism Ⅱ, ZR connecting plate 1, side fixing plate 2, laser fixing plate 3, CCD mechanism Ⅲ and glue dispensing laser mechanism Ⅳ , the back of the Z-axis linear module of the Z-axis mechanism is connected to the ZR connecting plate, and the side of the Z-axis linear module is connected to the side fixing plate; the R-axis mechanism is installed on the front of the Z-axis mechanism through the ZR connecting plate ; The CCD mechanism is installed on the front of the R-axis mechanism; the dispensing laser mechanism is installed on the right side of the R-axis mechanism through the laser fixing plate.

[0033]The Z-axis mechanism includes a Z-axis motor 4, a Z-axis motor mounting plate 5, a Z-axis coupling 6, the Z-axis linear module 7, a Z-axis linear module slider 8, an XZ connecting block 9, and a Z-axis A shaft mounting ...

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Abstract

The invention relates to an adhesive dispensing and curing mechanism movable in the Z-axis direction. The adhesive dispensing and curing mechanism is characterized in that the back of the Z-axis linear module of the Z-axis mechanism of the adhesive dispensing and curing mechanism is connected with a ZR connecting plate, and the lateral part of the Z-axis linear module is connected with a lateral fixing plate; an R-axis mechanism is mounted on the front portion of the Z-axis mechanism through the ZR connecting plate; a CCD mechanism is mounted on the front portion of the R-axis mechanism; an adhesive dispensing laser mechanism is mounted on the right side of the R-axis mechanism through a laser fixing plate; the Z-axis mechanism conveys the R-axis mechanism to an operation position; the clamping jaw of the R-axis mechanism moves to a small part fetching position to clamp a small part; the CCD mechanism moves above a product to take a picture so as to determine an adhesive dispensing position; the laser of the adhesive dispensing laser mechanism moves to the adhesive dispensing position of the product and measures adhesive dispensing height, and an adhesive dispensing valve moves to the adhesive dispensing position to perform adhesive dispensing; the clamping jaw moves to the adhesive dispensing position to adhere the small part and performs UV curing. By the adhesive dispensing and curing mechanism which is accurate in adhesive dispensing position, the small part can be accurately assembled to the electronic product, product quality is increased, work efficiency is increased, and cost is lowered.

Description

Technical field: [0001] The invention relates to the field of dispensing and curing equipment, and more specifically relates to a dispensing and curing mechanism movable in the Z-axis direction. Background technique: [0002] In the production process of electronic products, some small parts need to be assembled on the electronic products. In some small factories, it is all done manually. Due to the small size of small parts, positioning is relatively difficult, and it is easy to cause worker fatigue, resulting in long production time and low production efficiency, and the small parts assembled on the product are prone to looseness, inaccurate positioning and other quality problems. At this time, a dispensing and laminating curing mechanism that can accurately assemble small parts to electronic products is needed, which can save manpower, improve production efficiency, and reduce the company's production costs. Invention content: [0003] The object of the present invent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16B11/00
CPCF16B11/006
Inventor 吕绍林汪炉生朱晓锋叶友乐聂星李星
Owner BOZHON PRECISION IND TECH CO LTD
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