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Collecting device for sheet type integrated circuit plating equipment

A technology for integrated circuits and electroplating equipment, which is applied in the field of material receiving devices of chip integrated circuit material electroplating equipment, and can solve problems such as low overall efficiency and error-proneness.

Active Publication Date: 2015-04-29
东莞奥美特科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, in the process of electroplating sheet materials such as integrated circuit lead frames, for the sheet materials after electroplating, manual collection is usually used to collect the sheets, which not only makes the overall efficiency of sheet electroplating low and error prone

Method used

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  • Collecting device for sheet type integrated circuit plating equipment
  • Collecting device for sheet type integrated circuit plating equipment
  • Collecting device for sheet type integrated circuit plating equipment

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Embodiment Construction

[0032] It should be understood that the specific embodiments described here are only used to explain the present invention, and are not intended to limit the present invention.

[0033] The invention provides a material receiving device of chip type integrated circuit material electroplating equipment, the material receiving device of chip type integrated circuit material electroplating equipment is used in the chip type integrated circuit material electroplating equipment, so as to carry out the sheet material after electroplating is completed Receipt. see Figure 1 to Figure 16 , in one embodiment of the material receiving device of the chip integrated circuit material electroplating equipment of the present invention, the material receiving device of the chip type integrated circuit material electroplating equipment includes a machine base 4, a monolithic rack assembly installed on the machine base 4 3. The receiving box assembly 2 and the frame 5, and the receiving clip a...

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Abstract

The invention discloses a collecting device for sheet type integrated circuit plating equipment. The collecting device comprises a base and further comprises a sorting frame assembly, a collecting box assembly, a stand and a collecting clamp assembly which are arranged on the base; the collecting clamp assembly is arranged above the collecting box assembly; the front end and the rear end of the sorting frame assembly are respectively provided with a feeding hole and a temporary storage area, wherein the temporary storage area of the sorting frame assembly is arranged near the front end of the collecting box assembly and extends to the position below the collecting box assembly; the collecting clamp assembly comprises a horizontal guide rail mechanism, an adsorbing component and two clamping components, wherein the adsorbing component and the two clamping components can be arranged on the horizontal guide rail mechanism in a horizontal sliding way and a vertical lifting way; and the collecting box assembly comprises a collecting box mounting support, a collecting box and an auxiliary box, wherein the collecting box and the auxiliary box are arranged on the collecting box mounting support. The collecting device for the sheet type integrated circuit plating equipment can be used for collecting sheets automatically in the process of plating the sheets, thus the integral plating efficiency of the sheets can be improved effectively.

Description

technical field [0001] The invention relates to the technical field of electroplating equipment, in particular to a material receiving device of chip integrated circuit material electroplating equipment, which can be used for the electroplating equipment to automatically collect materials after electroplating. Background technique [0002] At present, in the process of electroplating sheet materials such as integrated circuit lead frames, for the sheet materials after electroplating, manual collection is usually used to collect the sheets, which not only makes the overall efficiency of sheet electroplating Low and error-prone. Contents of the invention [0003] The main purpose of the present invention is to provide a material receiving device of chip integrated circuit material electroplating equipment, aiming at realizing automatic material receiving of the sheet after electroplating, so as to improve the overall electroplating efficiency of the sheet. [0004] In order...

Claims

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Application Information

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IPC IPC(8): C25D7/12C25D17/00
Inventor 苏骞刘全胜柳兴森乌磊彭仕镇
Owner 东莞奥美特科技有限公司
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