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Conductive adhesive film for reinforcing metal steel in printed circuit board and manufacture process of conductive adhesive film

A technology of printed circuit boards and conductive adhesive films, which is applied in the direction of rubber layered products, lamination, coating, etc., can solve the problems of unstable conduction resistance, low peel strength of stainless steel sheets, and affect the performance of electronic products, etc., to achieve The effects of strong adhesion, good industrial promotion prospects, and good conduction performance

Inactive Publication Date: 2015-04-22
SUZHOU CHENGBANG DALI MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conductive adhesives have problems such as low peel strength with stainless steel sheets and unstable on-resistance, which seriously affect the performance of electronic products. Therefore, it is urgent to improve

Method used

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  • Conductive adhesive film for reinforcing metal steel in printed circuit board and manufacture process of conductive adhesive film
  • Conductive adhesive film for reinforcing metal steel in printed circuit board and manufacture process of conductive adhesive film

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Embodiment Construction

[0025] The present invention will be specifically introduced below in conjunction with the accompanying drawings and specific embodiments.

[0026] see figure 1 , a conductive adhesive film for metal steel reinforcement in a printed circuit board of the present invention, comprising: a heat-resistant lamination protective film layer 1 and a conductive adhesive film layer 2 coated thereon, thus forming a double layer Structured conductive film.

[0027] Preferably, the heat-resistant lamination protective film layer is a high molecular polymer film, which mainly plays a role of lamination protection and bearing for the conductive adhesive film layer 2, and can be one or more of PET, PEN, PI, PBT, PPS films The modified film has a thickness of 25-200 microns; the conductive adhesive film layer 2 is composed of an adhesive body and conductive powder distributed in the adhesive body, and the materials of the conductive powder are silver powder, silver-coated copper powder, copper...

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Abstract

The invention discloses a conductive adhesive film for reinforcing metal steel in a printed circuit board and a manufacture process of the conductive adhesive film. The conductive adhesive film comprises a heat-resisting laminated protective film layer and a conductive adhesive film layer which covers the heat-resisting laminated protective film layer. The conductive adhesive film has beneficial effects that the conductivity is good, charges can be successfully conducted from the printed circuit board to a metal reinforced steel sheet by virtue of a conductive resistor being lower than 100 micro ohms, the entire conductive adhesive film is high in flexibility, strong in adhesion force on metal and capable of meeting the application requirements on reinforcing the steel sheet; moreover, the manufacture process is simple and easy to implement and good in industrial popularization prospect.

Description

technical field [0001] The invention relates to a conductive adhesive film for reinforcing metal steel in a printed circuit board and its manufacturing process. The conductive adhesive film has the characteristics of lamination (that is, pressing with a pressing machine) and low conduction resistance; The field of electronic products. Background technique [0002] Printed circuit boards are an indispensable material in electronic products, and are widely used in computers and their peripheral equipment, communication products and consumer electronics products. As the demand for consumer electronics products continues to grow, the requirements for printed circuit boards are also increasing. Every day. [0003] The printed circuit board mainly consists of a copper clad laminate substrate (FCCL or CCL) and a protective cover film or printing ink. Since the flexible printed circuit board is relatively soft, the printed circuit board needs to increase the strength and conductiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B25/02B32B25/08B32B27/04B32B27/08B32B37/06B05D7/04
CPCB32B25/08B05D7/04B32B7/06B32B27/08B32B37/06B32B2260/046B32B2264/105
Inventor 董青山高小君鲁锦凌须田健作
Owner SUZHOU CHENGBANG DALI MATERIAL TECH
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