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Light-emitting device and packaging method for light-emitting device

A technology of light-emitting devices and packaging methods, which is applied in semiconductor devices, electric solid-state devices, semiconductor/solid-state device manufacturing, etc., and can solve the problems that the packaging effect is not as good as that of thin-film packaging.

Active Publication Date: 2015-04-08
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the full resin composition, the encapsulation effect is not as good as the film encapsulation

Method used

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  • Light-emitting device and packaging method for light-emitting device
  • Light-emitting device and packaging method for light-emitting device
  • Light-emitting device and packaging method for light-emitting device

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Experimental program
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Effect test

Embodiment 1

[0034] Please refer to figure 1 , the light-emitting device 100 according to Embodiment 1 of the present invention includes a substrate 110, an organic light-emitting element 120 disposed on the substrate 110, an inorganic material layer 130 covering the organic light-emitting element 120, an organic material layer 140 covering the inorganic material layer 130, and an organic light-emitting element covering the organic light-emitting element 120. The resin film layer 150 of the material layer 140 , and the inorganic sealing layer 160 covering the resin film layer 150 .

[0035] In this embodiment, the inorganic material layer 130 is deposited on the organic light-emitting element 120 first, wherein the inorganic material can be inorganic nitride or inorganic oxide, such as aluminum oxide, silicon oxide, silicon nitride, zirconium oxide, and titanium oxide. The organic material layer 140 is arranged on the inorganic material layer 130, which is adjacent to the resin film layer ...

Embodiment 2

[0046] Please refer to image 3 , the light-emitting device 200 of Embodiment 2 of the present invention includes a substrate 210, an organic light-emitting element 220 disposed on the substrate 210, an inorganic material layer / organic material layer 230 covering the organic light-emitting element 220, an inorganic material layer / organic material layer 230 covering the The resin film layer 250, and the inorganic sealing layer 260 covering the resin film layer 250.

[0047] In this embodiment, the only difference from Embodiment 1 is: In the inorganic material layer / organic material layer 230, the inorganic material layer and the organic material layer are alternately arranged in multiple layers, all of which are more than two layers, multi-layer inorganic material layers The organic material layer can further improve the encapsulation effect. In addition, the manufacturing process of the light-emitting device 200 is the same as that of the light-emitting device 100 , the only...

Embodiment 3

[0050] Please refer to Figure 4 , the light-emitting device 300 of Embodiment 3 of the present invention includes a substrate 310, an organic light-emitting element 320 disposed on the substrate 310, an inorganic material layer / organic material layer 330 covering the organic light-emitting element 320, an inorganic material layer / organic material layer 330 covering the The resin film layer 350, and the inorganic sealing layer 360 covering the resin film layer 350.

[0051] The structure of the light emitting device 300 is similar to that of the light emitting device 200 , the difference is that in Embodiment 3, a transparent water absorbing layer 370 is provided between the resin film layer 350 and the inorganic material layer / organic material layer 330 . The transparent water-absorbing layer 370 is made of transparent water-absorbing materials such as acrylic resin or silicon monoxide, which can absorb a small amount of water vapor entering the resin film layer 350, thereby ...

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Abstract

The invention relates to a light-emitting device and a packaging method for the light-emitting device, wherein the light-emitting device comprises a substrate, an organic light-emitting component, an inorganic material layer, an organic material layer, a resin film layer and an inorganic sealing layer, wherein the organic light-emitting component is arranged on the substrate; the inorganic material layer and the organic material layer are alternately arranged on the substrate, and cover the organic light-emitting component; the resin film layer covers the inorganic material layer and the organic material layer; the inorganic sealing layer covers the resin film layer. According to the light-emitting device and the packaging method for the light-emitting device, the resin film layer is further arranged on an inorganic / organic film formed by the inorganic material layer and the organic material layer, the resin film layer has an excellent full-coverage effect, and the defect that the inorganic / organic film cannot well cover particles, such as dust, can be well compensated, and the inorganic sealing layer is further arranged on the resin film layer, so that the defect that the resin film layer has a poor sealing effect is overcome. According to the light-emitting device and the packaging method for the light-emitting device, the influence on the packaging effect from external particles, such as the dust, can be eliminated or weakened, and the yield and packaging effect of film packaging are improved.

Description

technical field [0001] The invention relates to the field of manufacturing organic light emitting devices, in particular to an organic light emitting device and a packaging method thereof. Background technique [0002] Flexible OLED (FOLED) has the advantages of wide viewing angle and high brightness of ordinary OLED. At the same time, because the substrate of FOLED is a material with good flexibility, it is lighter, thinner and more impact-resistant than glass-substrate OLED display. Moreover, the preparation of FOLED is expected to be produced in a roll-to-roll manner, thereby greatly reducing the manufacturing cost. However, the existing glass encapsulation methods cannot correspond to FOLED encapsulation. [0003] There are two traditional packaging methods for flexible organic optoelectronic devices. [0004] (1) One is thin-film encapsulation technology, such as Vitex's Barix technology, in which thin-films are formed by layers of inorganic-organic materials (a few m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/8445H10K71/00
Inventor 祝晓钊朱修剑甘帅燕
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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