Lead-less ball foot surface adhesion type microwave film hybrid integrated circuit and integration method thereof

Abstract

The invention discloses a lead-less ball foot surface adhesion type microwave film hybrid integrated circuit and an integration method thereof. The integrated circuit consists of a film ceramic substrate, film conduction bands, film stop bands, a film capacitor, a film inductor, chip components, semiconductor naked chips and a tube cape, wherein through holes are formed between the front side and the bottom side of the film ceramic substrate; the film conduction bands, the film stop bands, the film capacitor and the film inductors are integrated on the front side of the film ceramic substrate; the bottom side of the film ceramic substrate is protected by using an insulating medium film; the bottom side of the film ceramic substrate is a ball foot type external connecting end; the tube cap is mounted on the front side of the film ceramic substrate in an adhesion manner; positively mounted semiconductor naked chips are connected with the film stop bands through bonding wires; inversely mounted semiconductor naked chips are welded with metal ball feet through ball feet; a metal layer is arranged on the outer layer of the tube cap; a ceramic coating layer is arranged on the inner wall of the tube cap. The integration method comprises the following steps: preparing materials, forming holes, washing, forming a graphic network, welding, assembling, bonding, capping, and the like. A device adopting the lead-less ball foot surface adhesion type microwave film hybrid integrated circuit is wide in application and is particularly applicable to the field of small-size facility systems.

Description

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AI Technical Summary

Benefits of technology

This patented technology describes an electronic component called this type of chip (C) mounted on a small area of plastic or rubber material. These C' s are designed without any external packages like solder connections between components. They have several technical benefits such as reducing size, eliminating extra parts, higher density, better signal quality, enhancing durability, being able to integrate multiple function modules within one unit, increasing functionality while maintaining compactness, and providing protection against damage from environmental factors during operation. Overall, these improvements make them more efficient than existing devices due to their smaller sizes and lesser number of necessary features compared to traditional methods.

Problems solved by technology

Technological Problem addressed by this patented technical problem relates to reducing package size while maintaining good performance at very small sizes due to the limitations associated with traditional methods like welding metal lines between electronic devices and solder connections that can cause signal distortion during operation.

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