Packaging structure and semiconductor process

Abstract

The invention relates to a packaging structure and a semiconductor process. The packaging structure comprises a first substrate, a second substrate, a grain, a plurality of electrical connection elements, at least one spacer element and a sealing compound. The grain is located between the first substrate and the second substrate; the at least one spacer element is arranged between the grain and the second substrate and is in contract with the grain and the second substrate. The electrical connection elements are electrically connected to the first substrate and the second substrate. The at least one spacer element is employed to support the second substrate, allowing a setting distance between the first substrate and the second substrate. The electrical connection elements do not require high intensity materials so as to reduce material cost. The at least one spacer element can control a distance and a space between the grain and the second substrate, allowing the sealing compound to smoothly flow into the space, avoiding generating air or gap in the space and increasing a product yield rate.

Description

technical field [0001] The invention relates to a packaging structure and a semiconductor process. Background technique [0002] In the known packaging structure, several electrical connection elements are used to electrically connect the two substrates, and in order to maintain the distance between the two substrates, it is necessary to use high structural strength electrical connection elements (such as: copper) to support between the two substrates , resulting in increased material costs. Moreover, if the distance between the die of the lower substrate and the upper substrate is too small, the sealant is difficult to flow in, causing air or gaps in the space between the die of the lower substrate and the upper substrate, which may cause product defects, for example, because the sealant is between the die and the upper substrate. The uneven distribution between the substrates results in a significant reduction in the mechanical strength of the sealant, reducing the reliab...

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Problems solved by technology

[0002] In the known packaging structure, several electrical connection elements are used to electrically connect the two substrates, and in order to maintain the distance between the two substrates, it is necessary to use high structural strength electrical connection elements (such as: copper) to support between the two substrates , resulting in an increase in material cost

Moreover, if the distance between the die on the lower substrate and the upper substrate is too small, the sealant is difficult to flow in, causing air or gaps in the space between the die on the lower substrate and the upper substrate, which may cause product defects, for example, because the sealant is between the die and the upper substrate. The uneven distribution between the substrates causes the mechanical strength of the sealant to be greatly reduced, reducing the reliability of the sealant itself and the adhesive strength of the sealant to the die or the upper substrate

[0003] In addition, when using the B-stage adhesive material as the cladding material, when pressing the upper substrate on the cladding material, since the B-stage adhesive material has not been fully cured, the distance between the crystal grains of the lower substrate and the upper substrate It is difficult to control. If the distance is too large, the electrical connection elements will not be able to contact the electrical contacts, which will cause an electrical short circuit. If the distance is too small, the die may be damaged during the process of pressing the substrate, resulting in product failure. Yield drop

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