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Electronic product reliability simulation test method based on physics of failure

A technology of electronic products and fault physics, applied in the direction of electrical digital data processing, special data processing applications, instruments, etc., can solve the problems of long development cycle, low test efficiency, difficulty in finding and improving potential defects, etc., to achieve shortened development cycle, The effect of improving efficiency and shortening the development cycle

Inactive Publication Date: 2015-03-25
CHINA AERO POLYTECH ESTAB
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Problems solved by technology

The reliability of traditional electronic products is based on mathematical statistics methods, it is difficult to find and improve potential defects in the design stage, almost all rely on "post-verification" to solve
However, there are data that show that a design flaw needs at least 10 times the cost to be exposed and solved through later tests or user feedback; at the same time, it takes a long time for test verification to draw a conclusion, the test efficiency is low, and the product development cycle is long

Method used

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  • Electronic product reliability simulation test method based on physics of failure
  • Electronic product reliability simulation test method based on physics of failure
  • Electronic product reliability simulation test method based on physics of failure

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Embodiment

[0034] An electromechanical management computer is installed in the equipment compartment of a certain type of aircraft, including a chassis, 10 modules, and 10,494 components of 272 types. The weight of the product is 15kg, the power consumption of the whole machine is 120W, and the natural cooling method is used for heat dissipation.

[0035] 1. Construct the digital prototype model of electronic products. According to the product design information, establish the digital prototype model of electromechanical management computer in the three-dimensional design software CATIA. The digital prototype model includes the digital prototype model of the chassis, 10 modules and 272 types of 10494 components .

[0036] 2. According to the environmental load profile, the finite element simulation analysis software Flotherm and Nastran are used to conduct thermal stress analysis and vibration stress analysis on the electromechanical management computer, and the thermal stress state and ...

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Abstract

The invention belongs to electronic product reliability test technology, and relates to an electronic product reliability simulation test method based on physics of failure. The method is characterized by including the following steps: constructing a digital prototype model; analyzing thermal stress state and vibration stress state under the loading condition; analyzing potential failure; determining a physics-of-failure model; performing thermal stress damage analysis and vibration stress damage analysis; performing electronic product reliability assessment. By the method, design defects of electronic products can be revealed as soon as possible, time for electronic product reliability test is reduced, efficiency of reliability test is increased, and accordingly development cycle of the electronic products is shortened, and development cost of the electronic products is lowered.

Description

technical field [0001] The invention belongs to the reliability test technology of electronic products, and relates to a reliability simulation test method of electronic products based on fault physics. Background technique [0002] Faced with the pressure of customer requirements and market competition, developers are investing more and more energy and cost in improving product reliability while satisfying the function / performance design of electronic products. And a reliable product doesn't come out of thin air, it's determined by design and achieved through manufacturing. The reliability of traditional electronic products is based on mathematical statistical methods. It is difficult to find and improve potential defects in the design stage, and almost all rely on "post-verification" to solve them. However, some data show that a design flaw needs at least 10 times the cost to be exposed and resolved through later tests or user feedback; at the same time, it takes a long t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 任占勇王昕陈新杜鑫李想曾晨晖王礼沅孙瑞锋
Owner CHINA AERO POLYTECH ESTAB
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