Ultrasonic wire bonding wire-lost detection device and method

Abstract

The invention discloses an ultrasonic lead bonding line loss detection device which comprises an upper computer for an operator to set a bonding parameter and a loss detection parameter, a communication interface for achieving real-time data transmission with the upper computer and timely transmitting an alarm signal to the upper computer when detecting a line loss fault, a master control module (STW32) connected with the communication interface and used for achieving a method including the steps of generating a decoding and driving signal instrument of the upper computer, processing acquisition signal and judging line loss detection, a signal generating module, a signal acquisition module and an ultrasonic transducer connected with the signal generating module and the signal acquisition module, wherein the signal generating module and the signal acquisition module are connected with the master control module (STW32). By means of an ultrasonic lead bonding line loss detection method, an impedance signal in the ultrasonic lead bonding process is detected, the detection speed is higher than the speed in an existing detection method, the real-time detection effect can be achieved, and normal bonding work efficiency is not influenced.

Description

technical field [0001] The invention relates to microelectronic packaging quality detection technology, in particular to an ultrasonic wire bonding quality loss detection device and detection method. Background technique [0002] Ultrasonic wire bonding is one of the most important technologies in the interconnection of IC chips; it provides the interconnection of pins between chips and substrates; it refers to the ultrasonic vibration and bonding tools generated by piezoelectric transducers in a normal temperature environment Under the action of pressure, the wire (gold or aluminum wire) is bonded to the bottom pad of the chip, thereby connecting the chip and the circuit of the substrate together. The quality of the bonding point will directly affect the performance of the IC chip, and a small bonding point failure may cause the failure of the entire IC chip. During the ultrasonic wire bonding process, the detection of wire breakage due to excessive wire pulling, wire clip...

AI Technical Summary

Problems solved by technology

This kind of off-line detection cannot timely feed back the fault information related to the key joint system

Use a high-power microscope to observe whether the lead wire is broken with the naked eye. The problem is that a large amount of manpower is required to check the working process, and only a fixed time interval can be used for random inspection. Failures are not found in time, and a lot of manpower is wasted, resulting in high costs.

[0003]The method of measuring the feeding amount of the lead wire through the rotary encoder has the problem that the feed amount of the lead wire changes very little, so it is not timely to find the wire breakage, and generally it takes The broken wire can only be detected after bonding about 40 times after the wire is broken, and the detection speed is slow

The problem with the method of batch identification of solder joints through computer vision is that firstly, a certain number of bonding needs to be met before unified detection, and the fault is not found in time. Secondly, there are many reasons for the failure of the bonding point, and it is not accurate to distinguish whether the cause of the fault is lost or not.

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