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Circuit structure for on-board microwave transceiving modules and manufacturing method thereof

A technology of circuit structure and transceiver components, applied in the direction of assembling printed circuits with electrical components, printed circuits connected with non-printed electrical components, etc., can solve the problems of expensive components and high manufacturing costs, achieve performance problems and reduce manufacturing. The effect of cost, strong practicability and application prospect

Inactive Publication Date: 2015-03-11
SHANGHAI RADIO EQUIP RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, the general T / R components are multi-layer boards made of low temperature co-fired ceramic technology (Low Temperature Co-fired Ceramic LTCC), which has high manufacturing costs and expensive components.

Method used

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  • Circuit structure for on-board microwave transceiving modules and manufacturing method thereof
  • Circuit structure for on-board microwave transceiving modules and manufacturing method thereof
  • Circuit structure for on-board microwave transceiving modules and manufacturing method thereof

Examples

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Embodiment Construction

[0027] The present invention will be further elaborated below by describing a preferred specific embodiment in detail in conjunction with the accompanying drawings.

[0028] Design multilayer printed circuit boards by rationally allocating the power supply layer, control layer and ground layer, using the principle of electromagnetic compatibility and the principle of multilayer circuit processing and wiring; according to the microstrip line theory, carry out the design of the microstrip board (including the calculation of the impedance of the microstrip line and corner standing wave simulation), to solve the electromagnetic compatibility problems of multi-layer boards caused by the types of power supplies of missile-borne microwave transceiver components and the variety of high and low speed control lines. In a very small space, a highly integrated, miniaturized multi-layer printed circuit board circuit board design is realized.

[0029] Such as figure 1 and figure 2 As sho...

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PUM

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Abstract

The invention discloses a circuit structure for on-board microwave transceiving modules. The circuit structure comprises a microstrip board and a plurality of layers of printed circuit boards; the printed circuit boards are disposed under the microstrip board layer by layer; each printed circuit board is provided with a plurality of ground holes; the ground holes of every two adjacent printed circuit boards correspond to one another. The invention further discloses a manufacturing method of the circuit structure. The circuit structure has good performances and is easy to manufacture and low in manufacturing cost.

Description

technical field [0001] The invention relates to the field of microwave component design, in particular to a circuit structure for missile-borne microwave transceiver components and a preparation method thereof. Background technique [0002] The missile-borne microwave transceiver component (T / R component) is a microwave transceiver component currently used in the phased array radar seeker, which has the advantages of excellent performance indicators, small size, and light weight. But at present, the general T / R components are multi-layer boards made of low temperature co-fired ceramic technology (Low Temperature Co-fired Ceramic LTCC), which has high manufacturing costs and expensive components. [0003] Multilayer printed circuit board (PCB), its manufacturing process is mature at present, and the price is also at a reasonable level. For components with high price and cost requirements such as missile-borne T / R components, multi-layer PCB boards are the preferred alternati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K3/34
Inventor 苏坪蒋开创
Owner SHANGHAI RADIO EQUIP RES INST
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