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Method for encapsulating LED device with metal substrate

A technology for LED devices and metal substrates, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of metal substrate deformation, metal substrate residue, etc., and achieve the effect of improving quality, avoiding the possibility of damage, and simple process implementation.

Active Publication Date: 2015-02-18
FUJIAN TIANDIAN OPTOELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a LED device packaging method with a metal substrate, which is used to solve the problem of deformation of the hollow metal substrate during the packaging process and the problem of residual glue on the back and hollow of the metal substrate

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  • Method for encapsulating LED device with metal substrate
  • Method for encapsulating LED device with metal substrate
  • Method for encapsulating LED device with metal substrate

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Embodiment Construction

[0040] The invention proposes a LED device packaging method with a metal substrate, the metal substrate is a hollow substrate, including: a film, a layer of film is pasted on the back of the metal substrate; crystal bonding, the LED chip is fixed on the metal substrate and bonded. wires to form a circuit; making a fluorescent layer, making a fluorescent layer on the LED chip; encapsulating, making a packaging layer on the LED chip to package the LED chip; removing the film, removing the film; slicing, cutting the metal substrate, so that each The LED chips form individual units.

[0041] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0042] Embodiment 1 of the LED device packaging method with a metal substrate of the present invention can be found in Figure 1 to Figure 6 shown.

[0043] The metal substrate 2 is a silver-plated copper sheet, which is a hollow substrate, and the hollow ...

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Abstract

The invention discloses a method for encapsulating an LED device with a metal substrate. The method is used for solving the problems that a hollowed-out metal substrate deforms in the encapsulating process, and residual glue exists on the back face and the hollowed-out parts of the metal substrate. The method for encapsulating the LED device comprises the steps of film attaching, wherein an attaching film is attached to the back face of the hollowed-out metal substrate; conducting solid phase crystallization, wherein LED chips are fixed to the metal substrate, and solid phase crystallization is conducted on weld lines to form circuits; manufacturing fluorescent layers, wherein the fluorescent layers are manufactured on the LED chips; conducting encapsulating, wherein encapsulating layers are manufactured on the LED chips, and the LED chips are encapsulated; film removing, wherein the attaching film is removed; conducting slicing, wherein the metal substrate is cut, and each LED chip forms an independent unit. By means of the technology, glue cannot remain on the back of the metal substrate, the phenomenon of loose contact can be avoided, and the additional process for removing the residual glue is not needed.

Description

technical field [0001] The invention relates to a packaging technology of an LED device. Background technique [0002] The existing technology is mainly based on thermosetting materials and silver-plated copper sheets, and the thermosetting materials are used to form bowls and brackets, and the crystal bonding wires are carried out in the bowls, fluorescent glue is coated, and finally LED devices are formed. [0003] If the thermosetting cup is not made, due to the ductility of the metal substrate, the metal substrate may undergo uncontrollable deformation when bonding wires on the metal substrate, resulting in unqualified products. In addition, the LED chip needs to be packaged on the metal substrate. When the existing hollow metal substrate is packaged, the encapsulation glue will flow into the back of the metal substrate along the hollow gap or hole to form a protrusion, which will cause the substrate Bad contact when soldered to the board. In order to avoid the problem...

Claims

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Application Information

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IPC IPC(8): H01L33/56H01L33/00
CPCH01L33/005H01L33/56H01L2933/005
Inventor 庄蕾蕾张月强
Owner FUJIAN TIANDIAN OPTOELECTRONICS CO LTD
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