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Three-dimensional integrated inductance structure

An integrated inductance, three-dimensional technology, applied in circuits, electrical components, electric solid devices, etc., can solve the problems of improving the quality factor Q value and unable to reduce the eddy current.

Inactive Publication Date: 2015-02-11
WUHAN XINXIN SEMICON MFG CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the above problems, the present invention provides a three-dimensional integrated inductance structure to solve the defects in the prior art that the inductive magnetic flux cannot be increased to increase the inductance value while reducing the eddy current and improving the quality factor Q value

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Embodiment Construction

[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0027] In order to reduce the eddy current while increasing the inductance magnetic flux to increase the inductance value, and improve the quality factor Q value and the performance of the inductance coil, the present invention provides a three-dimensional integrated inductance structure, including: a semiconductor substrate, on which The surface is prepared with an insulating layer; the magnetic core is arranged in the insulating layer and parallel to the semiconductor substrate; the inductance coil is in the shape of a three-dimensional spiral and surrounds the magnetic core in multiple turns in one direction, and the magnetic core includes several parallel arrangements The magnetic core unit, the inductance coil passes through the insulating layer and surrounds several magnetic core units in o...

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Abstract

The invention relates to the technical field of semiconductor fabrication, in particular to a three-dimensional integrated inductance structure; the three-dimensional integrated inductance structure is provided with a plurality of flaky magnetic core units arranged in parallel side by side, and a three-dimensional spiral inductance coil which is wound along the single direction by taking the flaky magnetic core units as a center, so that the inductive magnetic flux is greatly increased, the inductance value is increased, the vortex current is reduced, and the value of quality factor Q is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a three-dimensional integrated inductor structure. Background technique [0002] With the advancement of science and technology and the improvement of social informatization, more and more technical fields such as computers and communications have adopted radio frequency technology, which has promoted the rapid development of radio frequency technology (RFIC); for high frequency, low power consumption , low-distortion radio frequency technology requirements, making the inductance coil necessary. [0003] Since the most important indicator for evaluating the performance of inductors is the quality factor Q (quality), the quality factor Q (ie, Q value) is expressed as an energy storage device (such as an inductor coil, capacitor, etc.), the energy stored in the resonant circuit and the energy consumed per cycle Therefore, improving the quality factor Q of the i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/522
Inventor 梅绍宁鞠韶复朱继锋
Owner WUHAN XINXIN SEMICON MFG CO LTD
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