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Temperature measuring device capable of realizing stable temperature measurement and semiconductor device comprising temperature measuring device

A technology of temperature measuring device and fixing device, which is applied in the direction of measuring device, semiconductor/solid-state device testing/measurement, and electrical device, etc. It can solve the problems of slipping of insulating tube, affecting measurement results, and inability to contact objects to be measured. Achieve the effect of avoiding cracking, ensuring stability and accuracy

Active Publication Date: 2015-01-21
ADVANCED MICRO FAB EQUIP INC CHINA
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

When the traditional thermocouple is located in the insulating tube, it often cannot be in good contact with the object to be measured, and when maintaining the equipment, the thermocouple will slip with the insulating tube due to the drag during the maintenance process, which will affect the measurement results.

Method used

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  • Temperature measuring device capable of realizing stable temperature measurement and semiconductor device comprising temperature measuring device
  • Temperature measuring device capable of realizing stable temperature measurement and semiconductor device comprising temperature measuring device
  • Temperature measuring device capable of realizing stable temperature measurement and semiconductor device comprising temperature measuring device

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Embodiment Construction

[0021] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0022] figure 1 A schematic structural view of a semiconductor device according to the present invention is shown, the device includes at least one reaction chamber (not shown in the figure), an electrostatic chuck 110 is arranged in the reaction chamber, and the electrostatic chuck 110 is placed on a base 120, An insulating layer 115 is disposed on the surface of the electrostatic chuck 110 , and a temperature measuring device 200 is disposed inside the base 120 and the electrostatic chuck 110 . figure 2 A schematic structural view of the temperature measuring device according to the present invention is shown; the temperature measuring device 200 includes two thermal electrodes 201 of different materials, and two joint ends, a measuring end 202 and a free end o...

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Abstract

The invention discloses a temperature measuring device capable of realizing stable temperature measurement and a semiconductor device comprising the temperature measuring device. According to the temperature measuring device, a thermal electrode fixing device is arranged in an insulating tube; two thermal electrodes are fixed relative to the insulating tube, so that a measuring end can well contact with the surface of an object to be subjected to temperature measurement, and therefore, influence on measurement results which is caused by a situation in which the thermal electrodes slide relative to the insulating tube due to dragging in a maintenance process when daily equipment maintenance is performed can be avoided, and the stability and accuracy of the measurement results can be ensured; and a spring is arranged below the insulating tube, and therefore, the measuring end can well contact with the object to be subjected to temperature measurement through the elastic force of the spring, and at the same time, the fracture of the object to be subjected to temperature measurement which is caused by rigid contact of the temperature measuring device and the object to be subjected to temperature measurement can be avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to the technical field of accurate temperature measurement in semiconductor equipment. Background technique [0002] In the field of semiconductor manufacturing technology, temperature is an important technical indicator for the qualification of semiconductor substrate processing. The semiconductor substrate is usually placed on a substrate carrier during processing, and the semiconductor substrate is fixed by an electrostatic chuck above the substrate carrier. The surface temperature of the electrostatic chuck directly affects the uniformity of semiconductor substrate processing, so a temperature control device and a temperature measuring device are usually installed inside the electrostatic chuck to achieve uniform temperature of the electrostatic chuck. [0003] The temperature measuring device commonly used in the prior art is a thermocouple, which can directly measure t...

Claims

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Application Information

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IPC IPC(8): G01K7/02H01L21/66
Inventor 左涛涛吴狄倪图强
Owner ADVANCED MICRO FAB EQUIP INC CHINA
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