Temperature triggered ejection system and rework method for latch solder type components

A technology of ejection system and ejection direction, applied in welding equipment, auxiliary welding equipment, welding/cutting auxiliary equipment, etc. Effect

Inactive Publication Date: 2017-05-10
GLOBALFOUNDRIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Failure to remove a component with locking pins or any damage to the vias during component removal means scrapping the entire board

Method used

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  • Temperature triggered ejection system and rework method for latch solder type components
  • Temperature triggered ejection system and rework method for latch solder type components
  • Temperature triggered ejection system and rework method for latch solder type components

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Embodiment Construction

[0025] In the following discussion, a lot of specific details are provided to help thoroughly understand the present invention. However, it is obvious to those skilled in the art that even without these specific details, it does not affect the understanding of the present invention. And it should be realized that any specific terms below are used only for convenience of description, therefore, the present invention should not be limited to be used only in any specific application represented and / or implied by such terms.

[0026] Even though figure 1 with figure 2 Two shapes of lock pins are shown in and will be used in the following embodiments figure 2 The shape of the lock pin in is described as an example, but it should be understood that the term "lock pin" used herein is not limited to this, as long as it is a similar locking mechanism that can increase the friction force, it can be applied Object of the invention.

[0027] Figure 4 It is a schematic diagram showing a tem...

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PUM

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Abstract

The present invention relates to a temperature-triggered ejector system and rework method for latching-weld-type components. Provided is a temperature-triggered ejection system for a pin-soldering type component, the locking pin of which is fixed in a through hole of a circuit board and soldered in the through hole, the system comprising: an ejector, located on the opposite side of the circuit board from the component, and having an ejector pin aligned with a through hole of the circuit board and a cylinder for driving the ejector pin; a temperature sensor for sensing the heating of the solder temperature; the controller, based on the temperature sensed by the temperature sensor, drives the ejector pins of the ejector to eject the latch pins of the component from the circuit board within the solder melting temperature range.

Description

Technical field [0001] The present invention generally relates to the field of electronic product processing and manufacturing. More specifically, the present invention relates to a temperature-triggered ejection system and repair method for lock pin welding type components. Background technique [0002] Currently, for the assembly of electronic products, a process flow including the following steps is commonly used: printing -> Placement -> Reflow soldering -> Cleaning-> Detection -> Rework (rework). When a defect in an electronic product is detected, the electronic product is not directly scrapped, but repaired. By repairing electronic products to eliminate defects, the yield can be improved and production costs can be reduced. [0003] Some parts of the electronic product are equipped with lock pins to provide additional mechanical force for the interconnection between the part and the circuit board (or electronic card assembly). This lock pin is fixed (caught ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/225H05K3/308H05K2203/0195H05K2203/1581H05K2203/176H05K2201/09572B23K3/08B23K37/04B23K1/0016
Inventor 张伟锋蒲柯甄寿德黄小伟
Owner GLOBALFOUNDRIES INC
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