Glass substrate cutting and bearing device and cutting system

Abstract

The invention provides a glass substrate cutting and bearing device, comprising an upstream bearing platform, a downstream bearing platform, an auxiliary bearing platform and a mobile bracket, wherein the downstream bearing platform is arranged adjacently to the upstream bearing platform; the upstream bearing platform, the auxiliary bearing platform and the downstream bearing platform jointly load a to-be-cut glass substrate; the downstream bearing platform and the auxiliary bearing platform are arranged on the mobile bracket; the auxiliary bearing platform is arranged between the upstream bearing platform and the downstream bearing platform and is connected with a lifting drive element; the lifting drive element adjusts the height of the auxiliary bearing platform relatively to the upstream bearing platform; and after the glass substrate is cut, the auxiliary bearing platform ascends to the height of the overhead upstream bearing platform, is propped against the cut glass substrate, and drives the downstream bearing platform and the auxiliary bearing platform to depart from the upstream bearing platform through the mobile bracket.

Description

technical field [0001] The invention relates to the field of liquid crystal panels, in particular to a glass substrate cutting carrier device and a cutting system. Background technique [0002] The general structure of the existing glass substrate includes: a TFT substrate and a CF substrate laminated up and down, and liquid crystal molecules poured between the TFT substrate and the CF substrate. The prepared glass substrates are then cut and separated according to the size of different displays. The existing cutting technology is to use an upper cutter head and a lower cutter head to respectively cut the TFT substrate and the CF substrate at the gap between the upstream suction table and the downstream suction table. [0003] Such as figure 1 As shown, the glass substrate is placed on the carrier platform composed of the upstream station 2 and the downstream station 3, the glass substrate is separated from the position of the cutting line, and a step is formed at the cutt...

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Problems solved by technology

[0003] like figure 1 As shown, the glass substrate is placed on the carrier platform composed of the upstream station 2 and the downstream station 3, the glass substrate is separated from the position of the cutting line, and a step is formed at the cutting position of the left glass substrate 4 When the downstream station 3 moves away from the upstream station 2 and drives the right glass substrate 6 to translate, because the height of the downstream station 3 is lower than that of the upstream station 2 height, the glass substrate 6 will scratch the end 5 of the glass substrate 4, resulting in defective display panels

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