Electrochemical measurement-based method and device for measuring thickness of copper wire plating

Abstract

The invention relates to the field of cylinder plating thickness measurement, particularly to an electrochemical measurement-based method and device for measuring thickness of a copper wire plating. The electrochemical measurement-based method includes that a rubber ring reacting cup is replaced by a plastic reacting cup, a titanium wire is adopted as a cathode of a reacting electrode wire, a copper wire to be tested is adopted as an anode, and an instrument, originally for measuring sheet plating thickness with the coulometry, is adopted to measure the copper wire; an electric stirring pen is added to replace manual swinging, and measuring consistence is improved; different reacting lengths of the copper wires with different diameters are calculated according to the requirement for a plane reacting area of the measuring instrument, and producing a length fixing die and a length positioning rubber die according to the length required for reaction, in this way, reacting length measurement is accurate, and operational efficiency and precision is improved; after improvement, efficiency is increased by 4 times, and the precision and consistence of the test is increased by 10% from 30%.

Description

technical field [0001] The invention relates to the field of measuring the thickness of a column coating, in particular to a method and a device for electrochemically measuring the thickness of a copper wire coating. Background technique [0002] At present, there are several methods for testing the metal coating thickness of cylindrical metal bodies as follows: [0003] 1) Physical method: Use a micrometer caliper or a metallographic microscope to measure the diameter D1 of the metal body before plating, and then measure the diameter D2 of the metal body after plating, and the thickness of the coating H=(D2-D1) / 2. The poor accuracy of this method is affected by the accuracy of the instrument and the measurement readings, and can only achieve an accuracy of 1UM. It is a relatively rough method, which is suitable for occasions where the coating thickness is relatively thick. The metallographic microscope measurement method used by our company before. This method of measur...

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Problems solved by technology

[0007] In order to solve the problems of the above invention, the present invention proposes a method and device for electrochemically measuring the thickness of the copper wire coating, the method is simple, the device structure is reasonable, and the operation is convenient. Low cost, high test accuracy, solves the problem that small cylindrical metal wires cannot be measured, mainly for the needs of silver-plated and tin-plated layer thickness measurement of oxygen-free copper wire leads of high-voltage diodes, and improves the measurement accuracy

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