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material supply device

A technology for supplying devices and inner containers, applied in dispensing devices, special dispensing devices, packaging, etc., to achieve the effect of safe operation

Active Publication Date: 2019-04-09
HORIBA STEC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, when the material is spontaneously combustible, etc., and its handling must be handled with strict care, care is required to prevent leakage of the material from the pressurized gas introduction piping, supply piping, etc., when replacing the filling container.

Method used

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Examples

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Embodiment Construction

[0030] One embodiment of the material supply device of the present invention will be described below.

[0031] Such as figure 1 and figure 2 As shown, the material supply device 1 of this embodiment is a device that constitutes a part of a semiconductor manufacturing device. The material supply device 1 includes: an inner container 2 for containing a semiconductor material (for example, a liquid material with pyrophoric properties such as trimethylaluminum); The container 3 accommodates the inner container 2 so as to isolate the inner container 2 from the outside air; and the supply pipe 6b penetrates the outer container 3 and is connected to the inner container 2, and supplies the inner container 2 to a predetermined device such as a semiconductor manufacturing room. liquid material.

[0032] The inner container 2 includes: a hollow casing 2a for containing the liquid material; a first tubular body 2c provided so as to penetrate the upper wall of the casing 2a; and a secon...

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PUM

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Abstract

The present invention provides a material supply apparatus which can safely exchange a charging case without causing overstress of a user when exchanging the charging case. The material supply apparatus (1) includes an inner container (2) having a material therein and formed with an ejection port (20) to eject the material; an outer container (3) for accommodating the inner container (2) while isolating the inner container (2) from external air; a connection joint (4) to connect a supply pipe (6b), which provides a material to a predetermined device provided at an outside of the outer container (3), to the ejection port (20); and a joint manipulation tool (5) disposed at an outside of the outer container (3) while being isolated from external air to manipulate the connection joint (4) disposed in the outer container (3).

Description

technical field [0001] The present invention relates to a material supply device for supplying materials used, for example, in semiconductor manufacturing and the like. Background technique [0002] As such a material supply device, there is a device described in Patent Document 1. [0003] This device includes: a filling container filled with materials; a pressurized gas introduction pipe for introducing pressurized gas into the filling container; and a supply pipe for supplying the material in the filling container to the outside. The gas is pressurized in the gas space in the filling container, and the material is extruded to the supply pipe and supplied to the outside of the filling container. [0004] prior art literature [0005] Patent Document 1: Japanese Patent Laid-Open Publication No. 2011-25104 [0006] However, when the material is spontaneously combustible, etc., and its handling requires strict attention, care is required to prevent leakage of the material ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCB67D7/0266B67D7/22B67D7/32H01L21/67017H01L21/67253
Inventor 家城孝之长野忠幸
Owner HORIBA STEC CO LTD
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