Arc channel cooling case

A technology of chassis and arc, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of lack of air duct guide devices, lack of novelty, and the effect of fans can not be played well, to achieve Air duct optimization, good heat dissipation performance, and improved fan efficiency

Inactive Publication Date: 2014-12-03
QINGDAO YONGTONG ELEVATOR ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In real life, desktop computer cases all adopt a square structure. Using this structure not only lacks novelty, but also because of the lack of air duct guide devices in the case, the wind force in the case cannot be well concentrated, and the fan effect cannot be well exerted.

Method used

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  • Arc channel cooling case

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Embodiment Construction

[0012] Below in conjunction with accompanying drawing and example the present invention will be further described:

[0013] Such as figure 1 As shown, the arc heat dissipation chassis includes: ventilation net 1, baffle plate 2, fan fixing frame 3, honeycomb ventilation net 4, optical drive fixing bracket 5, hard disk fixing bracket 6, power supply fixing bracket 7, expansion card fixing platform 8, hard disk connection The wire passes through the port 9, the main body of the case 10, the main board fixing platform 11 and the side cover 12 of the case. The power supply fixing frame 7, the expansion card fixing platform 8 and the main board fixing platform 11 are fixed in the inner cavity of the chassis main body 10 by screws, the side cover 12 of the chassis is connected with the chassis main body 10 by screws, and the honeycomb ventilation net 4 is inlaid on the surface of the chassis main body.

[0014] Preferably, the optical drive fixing frame, the hard disk fixing frame,...

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PUM

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Abstract

The invention relates to an arc channel cooling case. The arc channel cooling case comprises a ventilation net, a baffle plate, a fan fixing frame, a honeycomb ventilation net, an optical drive fixing frame, a hard disk fixing frame, a power supply fixing frame, an expansion card fixing table, a hard disk connecting wire through opening, a case main body, a main board fixing table and a case side cover; the ventilation net is embedded into a surface body of the case main body; the baffle plate, the fan fixing frame, the optical drive fixing frame, the hard disk fixing frame, the power supply fixing frame, the expansion card fixing table and the main board fixing table are fixed in an inner chamber of the case main body through corresponding screws; the case side cover is connected with the case main body through screws; the honeycomb ventilation net is embedded into the surface body of the case main body. According to the arc channel cooling case, the center of gravity is reduced and accordingly the stability is high and an air duct is optimized and accordingly the fan efficiency is improved and the cooling performance is good.

Description

technical field [0001] The invention relates to an electronic product, which is an arc heat dissipation chassis. Background technique [0002] In real life, desktop computer cases all adopt a square structure. Using this structure not only lacks novelty, but also because of the lack of air duct guide devices in the case, the wind force in the case cannot be well concentrated, and the fan effect cannot be well exerted. . Contents of the invention [0003] The present invention mainly aims at the above problems, and provides an arc cooling chassis with a lower center of gravity, more stable air ducts, improved fan efficiency, and better heat dissipation performance. The technical scheme adopted is as follows: [0004] The arc heat dissipation chassis includes: ventilation net, baffle, fan fixing frame, honeycomb ventilation net, optical drive fixing bracket, hard disk fixing bracket, power supply fixing bracket, expansion card fixing platform, hard disk connection cable pas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
Inventor 丁兆年杨光代立超
Owner QINGDAO YONGTONG ELEVATOR ENG
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