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Method and device for filling raw ceramic through holes with metal paste

A technology of metal paste and filling method, applied in the direction of forming the electrical connection of printing elements, can solve the problems of high cost, complicated operation, low efficiency, etc., and achieve the effects of improving production efficiency, simple operation and obvious effect.

Active Publication Date: 2014-11-05
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to avoid the deficiencies of the prior art, the present invention proposes a filling method and device for filling metal paste into green ceramic through holes, and provides a low-cost, high-efficiency, high-stability multilayer co-fired ceramic circuit In the process of substrate processing, the metal paste filling method of the through hole on the green porcelain is maskless, so as to solve the problems of high cost, low efficiency and cumbersome operation of the existing hole filling method

Method used

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  • Method and device for filling raw ceramic through holes with metal paste
  • Method and device for filling raw ceramic through holes with metal paste
  • Method and device for filling raw ceramic through holes with metal paste

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Embodiment Construction

[0025] Now in conjunction with embodiment, accompanying drawing, the present invention will be further described:

[0026] The device of this embodiment is as figure 1 As shown, it includes a hole filling pressure generating device 1, a first gas line 2, a pressurized sealing device 3, a green ceramic tape 4, a hole filling slurry 8, a gas-permeable flat plate 5, a metal bracket 6, and a second gas line 9. Vacuum generating device 7. Its section is as figure 2 as shown, image 3 Yes figure 2 Partial cross-sectional view of region A-A' in Fig.

[0027] The pressure generating device 1 is airtightly connected to the first gas circuit interface 2-1 through the interface 1-1, and at the same time, the other end interface 2-2 of the first gas circuit is connected to the gas circuit interface 3 of the pressurized sealing device -2 achieves a sealed connection. 3-1 in the pressurized sealing device is an air cavity, which provides space for placing raw porcelain and slurry, a...

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Abstract

The invention relates to a method and device for filling raw ceramic through holes with metal paste. A supporting film (mylar film or an equivalent film) on the back of a raw ceramic chip serves as a mask when the holes are filled, the metal paste for hole filling is evenly smeared on the supporting film, the raw ceramic, the supporting film and the paste are placed in a sealed space, and the surface of the raw ceramic makes contact with a working platform; on one hand, vacuum pumping is carried out on the raw ceramic chip with the through holes from the lower portion, and on the other hand, the evenly smeared paste is squeezed from the upper portion, and the metal paste enters the raw ceramic through holes under the combined action of pumping force and pressure. According to the method and device, no hole filling mask plate is needed, operation is easy, the quality is stable, and compared with a traditional method for filling holes through a mask, the cost is lowered remarkably, and the production efficiency is improved by more than two times. The method and device are more remarkable in effect for multi-variety and small-batch products.

Description

technical field [0001] The invention belongs to the field of ceramic circuit substrate processing, and relates to a filling method and device for filling metal slurry into green ceramic through holes, which is a method for filling metal slurry into green ceramic through holes, and can be used for multilayer co-firing Metal paste filling of through holes during ceramic circuit substrate processing. Background technique [0002] Multilayer co-fired ceramic circuit substrates usually contain circuit elements such as metal patterns and through holes. The function of metal through holes is to realize interlayer interconnection and form electrical pathways, which occupy an important position in multilayer co-fired ceramic circuit substrates. If the hole filling quality is not high, it will lead to open circuits in the circuit network, which will seriously reduce the yield. [0003] For the metal through-hole filling of multi-layer co-fired ceramic circuit boards, most of the indu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42
Inventor 岳帅旗刘志辉
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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