Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate with built-in electronic component

A technology of electronic components and built-in substrates, which is applied in the field of built-in substrates of electronic components, and can solve problems such as component function impact and cracks

Active Publication Date: 2014-10-15
TAIYO YUDEN KK
View PDF4 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the stress caused by the thermal expansion or contraction of the upper surface layer will be directly transmitted to the fragile element body, causing damage such as cracks, which may affect the function of the element

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate with built-in electronic component
  • Substrate with built-in electronic component
  • Substrate with built-in electronic component

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach （ pic 1

[0041] [The first embodiment ( figure 1 and figure 2 )]

[0042] figure 1 It is a vertical cross-sectional view of the electronic component built-in substrate according to this embodiment. in addition, Figure 1 ~ Figure 3 The X-axis direction, Y-axis direction, and Z-axis direction in the graph represent three vertical (coordinate) axis directions, the X-axis direction and the Y-axis direction represent the horizontal direction, and the Z-axis direction represents the thickness direction (up-down direction).

[0043] First, explain figure 1The basic structure of the substrate with built-in electronic components is shown. The electronic component built-in substrate has: a component storage layer 11; The build-up layers 12 are respectively provided on the other surface (lower surface) perpendicular to the (thickness direction).

[0044] The component housing layer 11 has two electronic components P1 and P2, an insulating covering part 11b, and a base material 11c. The ...

no. 2 Embodiment approach （ pic 3）

[0080] image 3 The electronic components shown are built into the substrate and figure 1 The shown electronic component built-in substrate differs in structure in that the component housing layer includes a plurality of electronic components accommodated in one cavity portion 11a. In addition, similarly to the first embodiment, the covering portion 11b and the electronic components P1, P2 are accommodated in the cavity portion 11a, and the covering portion 11b is filled with the two electronic components P1, P2 and the cavity portion. 11a between the gaps between the way and set. In addition, in the step of forming the component housing layer of the substrate with built-in electronic components (component placement step), in addition to inserting the two electronic components P1 and P2 into one cavity portion 11a and then filling the uncoated portion 11b, Except for the difference of the hardened material, the other processes are the same as those described above.

[0081]...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a substrate with built-in electronic component, capable of preventing fault of an electronic assembly even when the heat insulating material on the electronic component expands with heat and shrinks with cold. The electronic component comprises a component storage layer and buildup layers. The component storage layer includes an electronic component and a cover portion having an insulating property. The electronic component includes a terminal surface and a main body. The cover portion includes a first surface formed to be flush with the terminal surface, covers the main body of the electronic component, and has a first linear expansion coefficient. The buildup layers each include an insulating layer and a via portion. The insulating layer contacts with the cover portion, is formed on the component storage layer and has a second linear expansion coefficient larger than the first linear expansion coefficient. The via portion is provided in the insulating layer and connected to the terminal surface.

Description

technical field [0001] The present invention relates to a multilayer structure electronic component built-in substrate (package substrate) built with electronic components. Background technique [0002] Electronic component built-in substrates generally have a structure in which conductive holes connected to terminals of the electronic component are provided on an insulating material formed on the surface of the electronic component, and a synthetic resin containing an insulating filler is used as the insulating material. In addition, the conduction hole part is formed by methods, such as irradiating laser light from the upper side of an insulating material, for example. [0003] For example, Patent Document 1 discloses an element-embedded substrate having an element-embedded resin layer having a side surface layer formed of a layer of the element-embedded resin layer lower than that of the chip element. The part of the upper surface is constituted; the upper surface layer ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0298H05K1/183H05K1/185H05K3/4602H05K2201/0209H05K2201/068H05K2201/10636H05K2203/1469H01L24/19H01L2924/12042H01L2224/04105H01L2924/19105Y02P70/50H01L2924/00
Inventor 杉山裕一猿渡达郎井上佑介宫崎政志
Owner TAIYO YUDEN KK
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com