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Device for collecting die cut excess materials of labels

A technology for collecting device and residual material, applied in metal processing and other directions, can solve problems such as affecting product quality, increasing costs, and inaccurate positioning

Inactive Publication Date: 2014-07-23
SUZHOU INDAL PARK TEAMS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When the existing label is die-cut, due to the influence of the product, after the general product is cut, the rest of the material remains in the positioning hole. Under long-term work, the positioning hole will become shallower and shallower. When the hole is about to overflow, it is generally excavated manually to clean up the remaining material. This work is inefficient and cannot meet the needs of today's society. At the same time, if it is not cleaned up immediately, the positioning will be inaccurate and affect the quality of the product. thereby increasing the cost

Method used

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  • Device for collecting die cut excess materials of labels
  • Device for collecting die cut excess materials of labels

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Experimental program
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Embodiment Construction

[0013] Such as figure 1 , figure 2 As shown, the collection device for label die-cutting residues includes a lower mold 3, an upper mold 1 matching the lower mold 3, a working groove is arranged on the lower mold 3, and positioning holes 4 are arranged around the working groove. The positioning holes 4 Arranged through the lower mold 3, the positioning hole 4 is connected to the air extraction device 6 through the communication pipe 5, the upper mold 1 is provided with a positioning block 2 matching the positioning hole 3, and the positioning hole 4 is collected with the remaining material through the communication pipe 5 The barrel 7 is connected to each other. By opening the positioning hole 4 around the working tank, the device can ensure that one end of the positioning hole 4 can be accurately pressed with the positioning block 2 on the upper mold 1, and at the same time pass through the other end of the positioning hole 4. The air extraction device 6 connected to the co...

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PUM

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Abstract

The invention provides a device for collecting die cut excess materials of labels. The device comprises a lower die and an upper die matched with the lower die, wherein a working groove is formed in the lower die, positioning holes are formed in the periphery of the working groove, penetrate through the lower die and are connected with an air extractor through communication pipes, and positioning blocks matched with the positioning holes are arranged on the upper die. The positioning holes penetrate through the lower die, so that the positioning holes have a positioning function and clear away the excess materials at once by being connected with the air extractor. By means of the device, excess material clearing speed is increased, and work efficiency is increased.

Description

technical field [0001] The invention relates to a collection device for label die-cutting residue. Background technique [0002] When the existing label is die-cut, due to the influence of the product, after the general product is cut, the rest of the material remains in the positioning hole. Under long-term work, the positioning hole will become shallower and shallower. When the hole is about to overflow, it is generally excavated manually to clean up the remaining material. This work is inefficient and cannot meet the needs of today's society. At the same time, if it is not cleaned up immediately, the positioning will be inaccurate and affect the quality of the product. Thereby increasing the cost. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a collection device for label die-cutting residues. [0004] The purpose of the present invention is achieved through the following technical ...

Claims

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Application Information

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IPC IPC(8): B26D7/18
Inventor 钱洪海
Owner SUZHOU INDAL PARK TEAMS TECH
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