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A double-wire parallel-wound non-inductive thin-film platinum thermal resistance

A platinum thermal resistance and thin-film technology, which is applied in the field of thin-film platinum thermal resistance, can solve the problems of inaccurate temperature measurement, lack of anti-electromagnetic interference ability of thin-film platinum thermal resistance, and interference of temperature measurement accuracy of thin-film platinum thermal resistance, so as to eliminate electromagnetic Interference, elimination of adverse effects, and effects of electromagnetic compatibility

Inactive Publication Date: 2016-08-31
NO 49 INST CHINESE ELECTRONICS SCI & TECH GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the existing thin-film platinum thermal resistance does not have the ability to resist electromagnetic interference, and the temperature measurement accuracy of the thin-film platinum thermal resistance is interfered by an external electromagnetic field, so it cannot measure temperature accurately, and provides a double-wire parallel-wound non-inductive thin film Platinum RTD

Method used

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  • A double-wire parallel-wound non-inductive thin-film platinum thermal resistance
  • A double-wire parallel-wound non-inductive thin-film platinum thermal resistance
  • A double-wire parallel-wound non-inductive thin-film platinum thermal resistance

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specific Embodiment approach 1

[0019] Embodiment 1: This embodiment is a double-wire parallel-wound non-inductive thin-film platinum thermal resistance, which includes encapsulating glass, metal platinum film 2, substrate 3, first lead 5 and second lead 6, and is characterized in that It also includes electrode paste connection 4;

[0020] Positive electrode 7, negative electrode 8 and thin-film platinum thermal resistance strip 9 are processed on metal platinum film 2; positive electrode 7 and negative electrode 8 are respectively connected with two thin-film platinum thermal resistance strips 9; The first resistance bar tap 10 and the second resistance bar tap 11 are provided at the part;

[0021] The metal platinum film 2 is deposited on the upper surface of the substrate 3; the first electrode hole 12 and the second electrode hole 13 are processed at the first resistance strip tap 10 and the second resistance strip tap 11, and the first electrode hole 12 and the second electrode hole 12 are processed. ...

specific Embodiment approach 2

[0034] Embodiment 2: This embodiment differs from Embodiment 1 in that: the material of the substrate 3 is an aluminum oxide ceramic substrate. Other steps are the same as in the first embodiment.

specific Embodiment approach 3

[0035] Embodiment 3: The difference between this embodiment and Embodiment 1 or Embodiment 2 is that the lead wire 5 is made of platinum wire. Other steps are the same as those in Embodiment 1 or 2.

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Abstract

The invention discloses a bifilar winding non-inductive film platinum thermistor and relates to a film platinum thermistor, aiming at solving the problems that since a conventional film platinum thermistor does not have electromagnetic interference resistance, the temperature measurement accuracy of the film platinum thermistor is interfered by an external electromagnetic field and the temperature cannot be accurately measured. The bifilar winding non-inductive film platinum thermistor comprises encapsulating glass, a metal platinum film, a substrate, leads and an electrode slurry connecting line, wherein a positive electrode, a negative electrode and film platinum thermistor stripes are arranged on the metal platinum film; the positive electrode and the negative electrode are respectively connected with two film platinum thermistor stripes; the metal platinum film is deposited on the upper surface of the substrate; the electrode slurry connecting line is printed on the lower surface of the substrate; a first electrode hole and a second electrode hole are connected through the electrode slurry connecting line; a first lead and a second lead are respectively welded on the upper surfaces of the positive electrode and the negative electrode; the first encapsulating glass is encapsulated on the upper surface of the metal platinum film. The invention can provide a bifilar winding non-inductive film platinum thermistor and relates to a film platinum thermistor.

Description

technical field [0001] The invention relates to a thin-film platinum thermal resistance. Background technique [0002] Existing temperature sensor temperature measuring elements made of platinum materials are divided into wire-wound platinum thermal resistors, thick-film platinum thermal resistors and thin-film platinum thermal resistors according to the state of platinum materials, all of which have good long-term stability. However, wire-wound platinum thermal resistance is expensive, bulky, small in resistance, and poor in vibration resistance; thick-film platinum thermal resistance is relatively economical in cost compared to wire-wound platinum thermal resistance, and has good mechanical vibration resistance, but it also has large volume, resistance The disadvantage of small value; compared with the above two products, the thin-film platinum thermal resistance has the advantages of small size, large resistance, light weight and fast thermal response speed, etc., but the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C3/02H01C17/075
Inventor 姜国光王震王大兴金建东程鑫王永刚孙志成刘成利
Owner NO 49 INST CHINESE ELECTRONICS SCI & TECH GRP
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