Method for solving problems of glue overflowing, glue attachment and glue drawing on needle in SMD (Surface Mount Device) type LED (Light Emitting Diode) sealing procedure by use of film releasing agent

Abstract

The invention discloses a method for solving problems of glue overflowing, glue attachment and glue drawing of a needle in SMD (Surface Mount Device) type LED (Light Emitting Diode) sealing procedure by use of a film releasing agent. The method comprises the following steps: a. after debugging a machine, wiping the surface of a glue dispensing needle with non-dust cloth to ensure that the surface is smooth, clean and dry and has no glue or other pollutants; b. dipping a piece of clean dust-free cloth in the film releasing agent, wiping a glue injection outlet of the glue dispensing needle with the non-dust cloth, wherein the film releasing agent needs to be prevented from dropping on the material under the needle during the process of dipping the dust-free cloth in the film releasing agent; c. checking the glue dispensing needle, wherein only a thin layer of film releasing agent is left on the surface of the glue dispensing needle, and the needle cannot be wiped with too much film releasing agent; d. evaporating the film releasing agent for 5-10min after wiping; and e. starting the machine for operation. According to the method, after the glue dispensing needle is wiped with the film releasing agent, the surface of the needle of the machine has certain repulsive action on epoxy resin adhesive for sealing and the problems of glue overflowing, glue attachment and glue drawing on the needle are solved well.

Description

technical field [0001] The invention relates to the field of LED packaging, and more specifically relates to a method for solving the problems of needle climbing, hanging and pulling glue in the SMD LED sealing process by using a film release agent. Background technique [0002] For the sealing process of the entire LED industry, due to the existence of the inherent polar hydroxyl and ether bonds in the epoxy resin molecule, it has high adhesion to various substances, so in the process of LED sealing process It is very easy to have the phenomenon of needle creeping. In the LED packaging process, needle creep is a very serious problem. When there is too much needle creep, it will form needle pull, which will cause serious unevenness in the amount of glue produced by the LED material, which seriously affects the product quality and quality of each company. Cost of production. [0003] The serious problem of needle creeping and hanging glue is increasingly valued by various c...

AI Technical Summary

Problems solved by technology

At present, most companies encounter the needle creeping phenomenon in the sealing process. The direct way is to replace the needle or replace the sealing ring, etc., or repeatedly wipe the creeping needle with a dust-free cloth, which will increase a large amount of production costs virtually, reduce production efficiency, and waste massive resources

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