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Forming method of internal middle frame board of electronic device and internal middle frame board

A molding method and frame plate technology, applied to the circuit layout on the support structure, the device for coating liquid on the surface, cooling/ventilation/heating transformation, etc., can solve the problems of excellent heat dissipation management performance and achieve excellent heat dissipation management performance , Improve the utilization rate of materials, and the effect of simple preparation process

Inactive Publication Date: 2014-06-04
亚超特工业有限公司
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  • Description
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AI Technical Summary

Problems solved by technology

It solves the problem that the internal middle frame board of the electronic device in the prior art is difficult to be light and thin at the same time, and has excellent thermal management performance

Method used

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  • Forming method of internal middle frame board of electronic device and internal middle frame board
  • Forming method of internal middle frame board of electronic device and internal middle frame board
  • Forming method of internal middle frame board of electronic device and internal middle frame board

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Embodiment Construction

[0039] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, these embodiments do not limit the present invention, and changes in structure, method or function made by those skilled in the art according to these embodiments are all included in the protection scope of the present invention.

[0040] The present invention uses the technology of high-speed cold spraying to directly spray the selected powder material on the surface of the main frame plate with high-speed cold spray to form a sprayed body to prepare a special structure. According to the function of the special structure, the powder The material is selected from a mixture of one or more of metal powder, alloy powder, plastic powder, and ceramic powder; and according to the different properties of the materials required for different functions of different special structures, each part of the spray-integrated body is formed The powder material...

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Abstract

The invention provides an internal middle frame board of an electronic device and a forming method of the internal middle frame board. The internal middle frame board comprises a main frame board body and a special structure body formed on the main frame board body. The special structure body is formed by directly combining powder materials with a spraying accumulation body on the surface of the main frame board body in a spraying accumulation mode. The special structure body is formed on the main frame board body through the method of gold gas dynamic spray, and then the internal middle frame board is formed through little machining or without machining. The internal middle frame board has a good thermal management function, and solves the problem that it is difficult for an internal middle frame board of an existing electronic device to be light and thin and achieve the good thermal management function at the same time.

Description

technical field [0001] The invention relates to an inner middle frame plate of an electronic device and a forming method thereof. Background technique [0002] Many 3C electronic devices (Computers, Communication and Consumer electronics), especially mobile electronic devices, have an internal middle frame plate for mounting electronic components and as a load-bearing structure for electronic equipment. The internal middle frame plate of the electronic device has various designs. In terms of structure and function, the internal middle frame plate is mainly composed of two parts. The first part is the main frame board that constitutes the main structure; the second part is the special structure on the surface of the main frame board, including the load-bearing structure for mounting electronic components and / or the functional structure for heat dissipation management, etc. [0003] Due to the difference in material properties (see Table 1) and the difference in the manufactu...

Claims

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Application Information

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IPC IPC(8): H05K7/02H05K7/20B05C19/04
Inventor 彭跃南陈学军曲峰曲荣生李惠宇沈强
Owner 亚超特工业有限公司
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