Single-glass touchpad and manufacturing method thereof

Abstract

The invention provides a single-glass touchpad. The single-glass touchpad comprises a covering plate, a bearing layer, a signal conductor and bonding adhesives, wherein a patterned conductive layer is formed on the bearing layer and comprises a sensing electrode, the signal conductor is electrically connected to the sensing electrode and is gathered in at least one bonding region, the bonding region or the bonding regions are located in at least one outer side edge of the sensing electrode, the thickness of the bonding region or the bonding regions is larger than the thickness of the bearing layer in a non-bonding region, and the bonding adhesives are arranged between the covering plate and the bearing layer and used for bonding the covering plate and the bearing layer. The invention further provides a manufacturing method of the single-glass touchpad. By means of the single-glass touchpad, the problem that a touch structure at the edge area of the bearing layer in the bonding region falls off easily or is damaged easily in the manufacturing process can be relieved, and further the yield of the single-glass touchpad is improved.

Description

technical field [0001] The present invention relates to touch technology, and in particular to a single glass touch panel and a manufacturing method thereof. Background technique [0002] In recent years, with the prevalence of mobile devices with touch functions such as smart phones and tablet computers, issues such as reducing the production cost of touch panels and making thinner and lighter touch panels have become increasingly important. Monolithic glass touch panels is one of the structures that can meet this requirement. [0003] Please refer to FIG. 1 , which shows a conventional technology for manufacturing a single-piece glass touch panel. Firstly, a release layer 12 is formed on the carrier substrate 10, and a support with a larger area is formed above it. Carrier 14, and after completing the manufacturing process of the touch structure 16 on the supporting carrier, it is cut along the edges C and C' of the release layer 12, and the carrier substrate 10 is made o...

AI Technical Summary

Problems solved by technology

However, in the process of separating the carrier substrate 10, since the thickness of the release layer 12 and the support carrier 14 itself is relatively thin and the touch structure 16 is mainly distributed in the central area of ​​the support carrier 14, when separating, the touch control in the edge area of ​​the support carrier 14 The structure is prone to fall off or damage, which will affect the yield of the touch panel

If a thicker release layer 12 and support carrier 14 are used, the light transmittance of the overall touch panel will be affected, which in turn will affect the display effect of the touch display device using the touch panel

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