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Negative photosensitive resin composition, partition wall, black matrix and optical element

A technology of photosensitive resin and composition, applied in the direction of optical components, optical components, electrical components, etc., can solve the problems of low resolubility, defect yield, reduction, etc., and achieve the effect of high resolubility

Active Publication Date: 2017-02-15
ASAHI GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

When the resolvability of the dried cured product in the photosensitive resin composition is low, the following problems arise: the dried cured product remaining in the nozzle part forms protrusions and remains, and when the photosensitive resin composition is coated on the substrate There may be problems such as streaks in the direction of the nozzle; the dry cured product of the photosensitive resin composition falls and adheres to the substrate, forming defects and lowering the yield.

Method used

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  • Negative photosensitive resin composition, partition wall, black matrix and optical element
  • Negative photosensitive resin composition, partition wall, black matrix and optical element
  • Negative photosensitive resin composition, partition wall, black matrix and optical element

Examples

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Embodiment

[0265] The following examples will be used to further describe the present invention in detail, but the present invention is not limited by these examples. Among them, Examples 1 to 11 are examples, and Examples 21 to 28 are comparative examples.

[0266] Abbreviations of compounds used in Synthesis Examples and Examples are as follows.

[0267] (Alkali-soluble resin (A))

[0268] ZCR1642: A resin in which an ethylenic double bond and an acidic group have been introduced into an epoxy resin having a biphenyl skeleton represented by the above formula (A1-2a) (manufactured by Nippon Kayaku Co., Ltd., trade name: ZCR-1642H, quality Average molecular weight (Mw): 5800, acid value: 100 mgKOH / g, solid content: 70% by mass, PGMEA: 30% by mass).

[0269] (Photopolymerization Initiator (B))

[0270] OXE02: ethyl ketone 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(O-acetyl oxime) (expressed by formula (3) In the compound, R 3 Indicates methyl, R 4 Indicates methyl, R 5 Ind...

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Abstract

Provided are a negative photosensitive resin composition, a partition wall having high light-shielding properties formed by curing the photosensitive composition, and an optical element having the partition wall, the negative photosensitive resin composition being capable of producing A black matrix containing a high concentration of pigments, high light-shielding properties, high resolubility, no defects in the coating film obtained by the slit coating method, and has a viscosity that can be applied by the slit coating method. A negative photosensitive resin composition, the negative photosensitive resin composition comprises an alkali-soluble resin, a photopolymerization initiator, a black colorant and a solvent, the content of the black colorant relative to the total solid content of the composition exceeds 20% by mass, the solvent contains a compound represented by R1O(C2H4O)2R2 (R1 represents a methyl group, and R2 represents an alkyl group with 2 or 3 carbon atoms.) in a ratio of 20 to 100% by mass relative to the total amount of the solvent, And a partition wall formed of the cured film, the partition wall is formed to partition the surface of the substrate into a plurality of divisions for pixel formation.

Description

technical field [0001] The present invention relates to a negative photosensitive resin composition, a partition using the same, a black matrix, and an optical element having the same. Background technique [0002] As for the partition wall used for the pixel part of a color filter and an organic EL (Electro-Luminescence) element, the method of apply|coating a photosensitive resin composition on a board|substrate and forming it by photolithography is known. Conventionally, coating of the photosensitive resin composition has been performed by a spin coating method. As the size of the substrate increases, coating by the spin coating method becomes difficult, and a coating method by the slit coating method has been proposed. [0003] When coating the photosensitive composition on the surface of the substrate by the slit coating method, the viscosity of the photosensitive resin composition is preferably lower than 3.5 mPa·s in order to obtain good film thickness uniformity, alt...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G02B5/20G03F7/027G03F7/031H01L21/027H01L51/50H05B33/12H05B33/22
CPCG02B5/223G03F7/0007G03F7/0048G03F7/027G03F7/031G03F7/038G03F7/0388G03F7/105H10K59/8792
Inventor 山田光太郎高桥秀幸川岛正行小尾正树
Owner ASAHI GLASS CO LTD
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