Electronic equipment casing structure with double-layer casing

Abstract

The invention relates to an electronic equipment casing structure with double casings. The structure comprises an outer casing and an inner casing, wherein a main machine electronic part is arranged in the outer casing, the inner casing is provided with a side opening, an embedding type function module is inserted into the side opening, and at least one part of the inner casing is arranged in a cavity of the outer casing. When the whole inner casing is arranged in the cavity of the outer casing, the opening side of the inner casing and a side plate of the outer casing are positioned on one plane, and the opening is directly formed on the side plate of the outer casing. When one part of the inner casing is exposed on the exterior of the outer casing, the opening side of the inner casing is directly exposed on the exterior of the outer casing. Compared with the prior art, the electronic parts in the outer casing and the inner casing cannot generate electromagnetic interference on each other through the self-shielding performance of each casing; when the embedding type function module is inserted or detached, the embedding type function module is only inserted into or plugged out of the opening at one side of the inner casing, so the main machine electronic part in the cavity of the outer casing cannot be exposed to the outside environment due to the installation or detachment of the embedding type function module, and the pollution by the outside environment is avoided.

Description

technical field [0001] The invention relates to a casing, in particular to a casing structure of electronic equipment used for double-layer casings of computers, instruments, communication equipment and the like. Background technique [0002] The casing usually refers to the casing used by various electronic products or electronic equipment. According to the use, it can be divided into: computer casing, TV casing, mobile phone casing, instrument casing, motor casing, etc. According to the material, it can be divided into plastic casing, alloy casing, composite material casing and so on. [0003] At present, there are generally two ways to connect and assemble host electronic components and embedded functional modules of existing electronic equipment or electronic products with the casing. The first connection and assembly method is to install the host electronic components in the casing, and The embedded function module is installed outside the case, and the embedded funct...

AI Technical Summary

Problems solved by technology

At the same time, it overcomes the defects that the original internal devices are easily polluted by electromagnetic radiation and dust in the environment when installing and disassembling the embedded functional modules inside the casing, and the defects of mutual electromagnetic interference between the original internal devices and the embedded functional modules are easily caused.

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