Fixing device and method for power amplifier

A technology for power amplifiers and fixtures, which is applied to printed circuits connected to non-printed electrical components, cooling/ventilation/heating transformation, etc., and can solve problems such as low heat dissipation requirements, poor heat dissipation effect of fixtures, and low power

Active Publication Date: 2016-09-07
SHENZHEN EXCERA TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the fixing device of the power amplifier of mobile wireless communication equipment usually has poor heat dissipation effect, and is only suitable for products with low power and low heat dissipation requirements; for high-power mobile wireless communication equipment, special power amplifiers are usually used at present. The power amplifier module is designed and manufactured by the amplifier manufacturer, but the cost of this method is high, and each dedicated power amplifier module needs a specific installation mechanism to cooperate, which brings great restrictions to the overall structural design of mobile wireless communication equipment

Method used

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  • Fixing device and method for power amplifier
  • Fixing device and method for power amplifier
  • Fixing device and method for power amplifier

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Embodiment Construction

[0037] The technical solution of the present invention will be further described below in conjunction with the drawings and specific embodiments of the specification. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0038] The invention provides a fixing device for a power amplifier.

[0039] Reference Figure 1 to Figure 4 , figure 1 Is a schematic diagram of an exploded structure of an embodiment of a fixing device for a power amplifier of the present invention; figure 2 Yes figure 1 A schematic cross-sectional view of the assembly structure of the fixing device of the power amplifier shown in FIG. image 3 Yes figure 1 The schematic diagram of the disassembled structure of the PCB and the fixing block of the fixing device of the power amplifier shown in FIG. Figure 4 Yes figure 1 The three-dimensional structure diagram of the first embodiment of the fixing block of th...

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Abstract

The invention discloses a fixing device and method of a power amplifier. The fixing device of the power amplifier includes: a fixing block, including a body and a convex part protruding from the body, and the top of the convex part is welded to the power amplifier; a PCB, including a The convex part is adapted to connect the through hole, the connecting part arranged around the through hole and grounded; the convex part is inserted into the through hole, and the thickness of the PCB is equal to the thickness of the convex part; through the electrical connection between the body and the connecting part, the fixed block is grounded; the heat sink , connected to the bottom surface of the body away from the top of the convex part and the PCB. Through the shape design of the fixing block and its connection with the PCB and the radiator, the present invention makes the cost of the fixing device of the power amplifier lower, the grounding impedance is low and the heat dissipation performance is good; and the manufacturing process of the present invention is simpler and the degree of automation is higher High, while ensuring the reliability of the power amplifier, it reduces the overall production cost and improves the cost performance of the product.

Description

Technical field [0001] The present invention relates to the field of power amplifiers, and in particular to a fixing device and method of a power amplifier. Background technique [0002] The power amplifier is an important part of various wireless communication equipment, and its ground impedance and heat dissipation effect determine the reliability and cost of the entire power amplifier. In the prior art, the fixed device of the power amplifier of the mobile wireless communication equipment usually has a poor heat dissipation effect, and is only suitable for products with low power and low heat dissipation requirements; for high-power mobile wireless communication equipment, currently dedicated power is usually used Power amplifier modules designed and manufactured by amplifier manufacturers, but the cost of this method is relatively high. Each dedicated power amplifier module requires a specific installation mechanism to cooperate, which brings greater restrictions to the overa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18H05K7/20
Inventor 陈军孙红业
Owner SHENZHEN EXCERA TECH
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