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Device and method for fixing power amplifier

A technology of power amplifier and fixing device, which is applied to printed circuits connected with non-printed electrical components, cooling/ventilation/heating transformation, etc., can solve the problem of low heat dissipation requirements, overall structural design limitations of mobile wireless communication equipment, and low power. And other issues

Active Publication Date: 2014-02-26
SHENZHEN EXCERA TECH
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  • Claims
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AI Technical Summary

Problems solved by technology

In the prior art, the fixing device of the power amplifier of mobile wireless communication equipment usually has poor heat dissipation effect, and is only suitable for products with low power and low heat dissipation requirements; for high-power mobile wireless communication equipment, special power amplifiers are usually used at present. The power amplifier module is designed and manufactured by the amplifier manufacturer, but the cost of this method is high, and each dedicated power amplifier module needs a specific installation mechanism to cooperate, which brings great restrictions to the overall structural design of mobile wireless communication equipment

Method used

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  • Device and method for fixing power amplifier
  • Device and method for fixing power amplifier
  • Device and method for fixing power amplifier

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Embodiment Construction

[0037] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0038] The invention provides a fixing device for a power amplifier.

[0039] refer to Figure 1 to Figure 4 , figure 1 It is a schematic diagram of an exploded structure of an embodiment of the fixing device of the power amplifier of the present invention; figure 2 yes figure 1 The cross-sectional schematic diagram of the assembly structure of the fixture of the power amplifier shown in ; image 3 yes figure 1 The schematic diagram of the exploded structure of the PCB and the fixed block of the fixed device of the power amplifier shown in ; Figure 4 yes figure 1 The three-dimensional structural diagram of the first embodiment of the fixing block of the fixin...

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Abstract

The invention discloses a device and a method for fixing a power amplifier. The fixing device of the power amplifier comprises a fixing block, a PCB (Printed Circuit Board) and a radiator, wherein the fixing block comprises a body and a convex portion which is convexly arranged at the body, a top end of the convex portion is welded with the power amplifier, the PCB comprises a through hole in matching with the convex portion and a connection portion which is arranged at periphery of the through hole and is in grounding connection, the convex portion is inserted into the through hole, thickness of the PCB is equal to thickness of the convex portion, the body is in electrical connection with the connection portion, the fixing block is in grounding connection, and the radiator is connected with a bottom face of the body far from a top end of the convex portion and the PCB. According to the device and the method, manufacturing technology is simpler, an automation degree is higher, work reliability of the power amplifier is guaranteed while integral production cost reduction and product cost performance improvement are realized.

Description

technical field [0001] The invention relates to the field of power amplifiers, in particular to a fixing device and method for a power amplifier. Background technique [0002] The power amplifier is an important part of various wireless communication devices, and its grounding impedance and heat dissipation effect determine the reliability and cost of the entire power amplifier. In the prior art, the fixing device of the power amplifier of mobile wireless communication equipment usually has poor heat dissipation effect, and is only suitable for products with low power and low heat dissipation requirements; for high-power mobile wireless communication equipment, special power amplifiers are usually used at present. The power amplifier module is designed and manufactured by the amplifier manufacturer, but the cost of this method is high, and each dedicated power amplifier module needs a specific installation mechanism to cooperate, which brings great restrictions to the overal...

Claims

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Application Information

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IPC IPC(8): H05K1/18H05K7/20
Inventor 陈军孙红业
Owner SHENZHEN EXCERA TECH
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