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Common Mode Signal Filter

A common-mode signal and filter technology, applied in the field of thin-film common-mode signal filters, can solve the problems of complex structure, increased manufacturing cost, and many process variables, and achieve the effect of eliminating common-mode noise and accurately controlling common-mode impedance.

Active Publication Date: 2016-03-02
INPAQ TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although the prior art discloses that the common-mode impedance can be controlled by changing the conductor pattern of the laminate, however, the conductor pattern and the insulating layer are alternately laminated, so the structure is more complicated, and there are many process variables affected
In addition, the prior art also discloses that the common mode impedance can be adjusted by adjusting the thickness of the insulating layer, but the thickness of the insulating layer is not easy to control, and this method will increase the manufacturing cost

Method used

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Examples

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no. 1 example 〕

[0108] see figure 1 , which shows an exploded view of the common-mode signal filter 1 of the first embodiment of the present invention. The common mode signal filter 1 includes a non-magnetic insulating substrate 10 , a coil stack structure 20 , an insulating layer 30 and a magnetic material layer 40 .

[0109] Specifically, the coil stack structure 20 is disposed on the non-magnetic insulating substrate 10, and the coil stack structure 20 sequentially includes a first coil body layer 21, a first electrical insulation layer 22, and a coil lead-out layer 23. , a second electrical insulation layer 24 and a second coil body layer 25 . Wherein the insulating layer 30 is disposed between the coil stack structure 20 and the magnetic material layer 40, so that the magnetic material layer 40 is applied on the coil stack structure 20 to become the cover of the common-mode signal filter 1, which can increase the common-mode signal filtering The inductance effect of device 1. In this ...

no. 2 example

[0122] see Figure 3A , which shows an exploded view of the common-mode signal filter 1A of the second embodiment of the present invention. The difference from the first embodiment is that the common mode signal filter 1A further includes another magnetic material layer 40, and the another magnetic material layer 40 is disposed on the coil stack structure 20 and the non-magnetic insulating substrate Between 10.

[0123] More specifically, the magnetic material layer 40 is interposed between the first coil body layer 21 and the non-magnetic insulating substrate 10 to achieve a higher common-mode noise filtering effect. Similarly, the bus length L (mm) and line width W (mm) of the first coil 211 and the second coil 251 can satisfy the following relational expression:

[0124] [(14.1-fc) / 6.5] 2 2 , where fc is the cutoff frequency of the differential mode signal, and the cutoff frequency is approximately between 4 and 10 MHz, which meets the requirements of specific portable e...

no. 3 example

[0126] see Figure 3B , which shows an exploded view of the common-mode signal filter 1B of the third embodiment of the present invention. The difference from the second embodiment is that the common mode signal filter 1B further includes a plurality of magnetic parts 50 . Specifically, these magnetic parts 50 are ferrite cores (Ferrite core), which have the advantages of high magnetic permeability, high resistance and small eddy current loss in a wide frequency range.

[0127]In addition, the first electrical insulation layer 22 and the second electrical insulation layer 24 are provided with a through hole 222 , 242 , and the through hole 222 and the through hole 242 are respectively adjacent to the first conductive structure 221 and the second conductive structure 241 . Thereby, these magnetic parts 50 can be arranged on the inner side of the first coil 211, one end of the pair of L-shaped wires 231 and the inner side of the second coil 251 through the through holes 222, 24...

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Abstract

The invention discloses a common-mode signal filter which comprises a nonmagnetic insulating base plate, a coil laminated structure, an insulating layer and a magnetic material layer. The common-mode signal filter is characterized in that the coil laminated structure is arranged on the nonmagnetic insulating base plate, wherein the coil laminated structure comprises a first coil and a second coil, the first coil and the second coil are coupled to remove common-mode noise together, the magnetic material layer covers on the coil laminated structure through the insulating layer, the total line length L (mm) and the line width W (mm) of one of the first coil and the second coil are satisfied with a relational expression below: L / W is greater than [(14.1-fc) / 6.5]2 but less than [(16.7-fc) / 4.5]2, wherein fc(MHz) is a cut-off frequency of a different-mode signal.

Description

technical field [0001] The invention relates to a common-mode signal filter, in particular to a film-type common-mode signal filter applied to portable electronic devices. Background technique [0002] A common-mode signal filter is a component used to suppress common-mode currents that may cause electromagnetic interference (EMI) in parallel transmission lines, which is a source of noise in electronic circuits. With the miniaturization of portable electronic devices, common-mode signal filters used in portable electronic devices are required to be miniaturized and high-density structures, so thin-film and laminated common-mode signal filters gradually replace traditional Wound type common mode filter. [0003] Japanese Patent Publication No. JP2000173824A discloses an electronic component, which has an insulating substrate, a laminated body, and an external electrode terminal portion; the laminated body is formed by alternately laminating conductor patterns and insulating ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F17/00H01F27/28H01F27/32H01F41/00
Inventor 张育嘉谢明峰陈觊维
Owner INPAQ TECH
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