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Common-mode signal filter

A common-mode signal and filter technology, applied in the field of thin-film common-mode signal filters, can solve the problems of increased manufacturing cost, complex structure, and many process variables, and achieves the effect of accurately controlling common-mode impedance and eliminating common-mode noise.

Active Publication Date: 2014-02-19
INPAQ TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although the prior art discloses that the common-mode impedance can be controlled by changing the conductor pattern of the laminate, however, the conductor pattern and the insulating layer are alternately laminated, so the structure is more complicated, and there are many process variables affected
In addition, the prior art also discloses that the common mode impedance can be adjusted by adjusting the thickness of the insulating layer, but the thickness of the insulating layer is not easy to control, and this method will increase the manufacturing cost

Method used

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Examples

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no. 1 example 〕

[0108] See figure 1 , Which shows an exploded view of the common mode signal filter 1 of the first embodiment of the present invention. The common mode signal filter 1 includes an insulating substrate 10 made of non-magnetic material, a coil laminated structure 20, an insulating layer 30 and a magnetic material layer 40.

[0109] Specifically, the coil laminate structure 20 is disposed on an insulating substrate 10 made of non-magnetic material, and the coil laminate structure 20 includes a first coil body layer 21, a first electrical insulating layer 22, and a coil lead-out layer 23 in sequence. , A second electrical insulation layer 24 and a second coil body layer 25. The insulating layer 30 is arranged between the coil laminated structure 20 and the magnetic material layer 40, so that the magnetic material layer 40 is covered on the coil laminated structure 20 to become the cover of the common mode signal filter 1, which can increase common mode signal filtering. The inductan...

no. 2 example

[0122] See Figure 3A , Which shows an exploded view of the common mode signal filter 1A of the second embodiment of the present invention. The difference from the first embodiment is that the common mode signal filter 1A further includes another magnetic material layer 40, and the other magnetic material layer 40 is disposed on the coil laminated structure 20 and the insulating substrate made of non-magnetic material. Between 10.

[0123] In more detail, the magnetic material layer 40 is sandwiched between the first coil body layer 21 and the insulating substrate 10 made of non-magnetic material to achieve a higher common mode noise filtering effect. Similarly, the bus length L (mm) and line width W (mm) of the first coil 211 and the second coil 251 can satisfy the following relational expressions:

[0124] [(14.1-fc) / 6.5] 2 2 , Where fc is the cutoff frequency of the differential mode signal, and the cutoff frequency is approximately between 4 to 10 MHz, which meets the requirem...

no. 3 example

[0126] See Figure 3B , Which shows an exploded view of the common mode signal filter 1B of the third embodiment of the present invention. The difference from the second embodiment is that the common mode signal filter 1B further includes a plurality of magnetic parts 50. Specifically, these magnetic parts 50 are ferrite cores, which have the advantages of high magnetic permeability, high resistance in a wide frequency range, and low eddy current loss.

[0127] In addition, the first electrical insulating layer 22 and the second electrical insulating layer 24 both have through holes 222 and 242, and the through holes 222 and the through holes 242 are adjacent to the first conductive structure 221 and the second conductive structure 241, respectively. Thereby, the magnetic parts 50 can be disposed on the inner side of the first coil 211, one end of the pair of L-shaped wires 231, and the inner side of the second coil 251 through the through holes 222 and 242 to increase the stabil...

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Abstract

The invention discloses a common-mode signal filter which comprises a nonmagnetic insulating base plate, a coil laminated structure, an insulating layer and a magnetic material layer. The common-mode signal filter is characterized in that the coil laminated structure is arranged on the nonmagnetic insulating base plate, wherein the coil laminated structure comprises a first coil and a second coil, the first coil and the second coil are coupled to remove common-mode noise together, the magnetic material layer covers on the coil laminated structure through the insulating layer, the total line length L (mm) and the line width W (mm) of one of the first coil and the second coil are satisfied with a relational expression below: L / W is greater than [(14.1-fc) / 6.5]2 but less than [(16.7-fc) / 4.5]2, wherein fc(MHz) is a cut-off frequency of a different-mode signal.

Description

Technical field [0001] The invention relates to a common mode signal filter, in particular to a thin film common mode signal filter applied to portable electronic devices. Background technique [0002] A common-mode signal filter is a component used to suppress common-mode currents, which can cause electromagnetic interference (EMI) in parallel transmission lines, which is a source of noise in electronic circuits. With the miniaturization of portable electronic devices, common-mode signal filters applied to portable electronic devices are often required to have a miniaturized and high-density structure. Therefore, thin-film and laminated common-mode signal filters are gradually replacing the traditional Coil type common mode filter. [0003] Japanese Patent Publication No. JP2000173824A discloses an electronic component having an insulating substrate, a laminated body, and an external electrode terminal portion; the laminated body is formed by alternately laminating a conductor pa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F17/00H01F27/28H01F27/32H01F41/00
Inventor 张育嘉谢明峰陈觊维
Owner INPAQ TECH
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