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Method for making circuit pattern on multilayer PCB

A PCB board and circuit graphics technology, which is applied in the field of multilayer PCB board circuit graphics production, can solve problems such as inability to meet development needs, and achieve the effect of reducing the difficulty of etching

Active Publication Date: 2014-02-12
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it cannot meet the development needs of high-frequency (ie above 38GHz) filters

Method used

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  • Method for making circuit pattern on multilayer PCB
  • Method for making circuit pattern on multilayer PCB
  • Method for making circuit pattern on multilayer PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The method for making the circuit pattern of the multilayer PCB board according to the embodiment of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0023] It should be clear that the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0024] Such as figure 1 Shown is a specific embodiment of the manufacturing method of the multilayer PCB circuit pattern of the present invention. The manufacturing method of described multi-layer PCB circuit pattern comprises:

[0025] Step S11, sticking a dry film on the surface of the metal layer of the multilayer PCB board, exposing the multilayer PCB board with the dry film attached to obtain an exposed area and an unexposed a...

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PUM

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Abstract

The embodiment of the invention discloses a method for making a circuit pattern on a multilayer PCB and relates to the technical field of PCB manufacturing methods. The method is used for manufacturing the circuit pattern with higher precision on the multilayer PCB. The method includes the steps that a dry film is pasted to the surface of a metal layer of the multilayer PCB, exposure is carried out on the multilayer PCB with the dry film pasted to obtain an exposed area and a non-exposed area, and the portion, located in the non-exposed area, of the dry film is removed; etching treatment is carried out on the portion, located in the non-exposed area, of the metal layer so that the circuit pattern corresponding to the exposed area can be formed on the portion, located in the exposed area, of the metal layer; the surface, corresponding to the exposed area, of the circuit pattern is covered by a protective layer; a via hole is formed in the portion, where the circuit pattern corresponding to the exposed area is located, of the multilayer PCB. The method is mainly applied to manufacturing PCB circuit patterns.

Description

technical field [0001] The invention relates to a method for making a PCB board, in particular to a method for making circuit patterns of a multilayer PCB board. Background technique [0002] At present, filters are usually used in high-frequency microwave products. The function of the filter is to filter the microwaves of different frequencies transmitted by high-frequency microwave products during work, so as to obtain microwaves of specific frequencies, which can then meet the needs of high-frequency microwave products. work needs. Usually, the filter is installed on a PCB board (Printed Circuit Board, printed circuit board) to realize the filtering function. The higher the accuracy of the circuit pattern of the filter, the greater the filtering ability. [0003] For example, the filter used in high-frequency microwave products is generally a chip ceramic filter. Since the chip ceramic filter is made by using the carrier board circuit processing technology, and the accur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
Inventor 陈立宇陈健刘山当
Owner HUAWEI TECH CO LTD
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