Device used for picking and placing IGBT lining plate

Abstract

The invention discloses a device used for picking and placing an IGBT lining plate. The device comprises a left clamping arm and a right clamping arm, wherein the middle of the left clamping arm and the middle of the right clamping arm are hinged together, the bottom of the left clamping arm and the bottom of the right clamping arm are arranged oppositely and form a lining plate clamping part together, and the lining plate clamping part is matched with the edge of the IGBT lining plate. The device used for picking and placing the IGBT lining plate has the advantages of being simple and compact in structure, low in cost, convenient to operate, good in universality and the like.

Description

technical field [0001] The invention mainly relates to the field of module packaging technology, in particular to a device suitable for picking and placing IGBT liners in the module packaging technology. Background technique [0002] The IGBT liner is made of ceramic material, with a size of 50mm×60mm and a weight of about 25g. The liner needs to be welded with IGBT chips and FRD chips, and aluminum leads need to be ultrasonically bonded. During the packaging and testing process of the IGBT module, the liner needs to go through multiple processes such as printing, welding, and testing. The picking and placing of the liner is an inevitable process in the IGBT packaging process. It needs to be picked up and put down continuously. Sometimes it is taken directly by hand, and sometimes it is clamped with tweezers. [0003] Manual operation is unavoidable when the automation degree of the module packaging process is not high. The current method of picking and placing the liner ma...

AI Technical Summary

Problems solved by technology

[0004] Due to human factors such as skill level and proficiency in different positions, there are many hidden dangers when taking and placing the lining board

The following problems exist in the removal and placement of the liner: ①When the liner is welded by hand, the liner is taken and placed manually, which is easy to touch the chip or solder, causing welding defects; ②The bonded liner is removed by hand. It is easy to touch the bonding aluminum wire and cause defects; ③When using tweezers to take and place the liner during the liner test, it may touch the chip or lead wire, resulting in defects, and at the same time, the tweezers are easy to damage the liner

At the same time, it belongs to a single support point, the stability is not good, and it is easy to slip; ④The lining board is patched manually, and it is also easy to touch the bonding wire on the lining board

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