Electromagnetic shielding structures for shielding components on a substrate

A technology of electromagnetic shielding structure and substrate, applied in local shielding, magnetic field/electric field shielding, printed circuit components, etc., can solve problems such as limiting the layout of radio frequency shielding cans

Active Publication Date: 2014-02-05
APPLE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This can limit the effectiveness of RF shielding can placement in situations such as where compact shielding is desired

Method used

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  • Electromagnetic shielding structures for shielding components on a substrate
  • Electromagnetic shielding structures for shielding components on a substrate
  • Electromagnetic shielding structures for shielding components on a substrate

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Embodiment Construction

[0040] The present disclosure relates to shielding structures for electrical components. The shielding structure may include a radio frequency shielding structure and / or a magnetic shielding structure. The electrical components shielded by the shielding structure may be components such as integrated circuits operating in radio frequency bands (e.g., transceiver integrated circuits, memory circuits, and other circuit). Shielding components may also include circuits formed from one or more discrete components such as inductors, capacitors and resistors, switches, and the like. A shielded electrical component can be an interferer (a component that generates radio frequency or magnetic signal interference) and / or a victim component (a component that is sensitive to interference received from an external source).

[0041] Shielding structures may help reduce interference from electromagnetic signals and may therefore sometimes be referred to as electromagnetic interference (EMI) ...

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Abstract

Electronic components on a substrate may be shielded using electromagnetic shielding structures. Insulating materials may be used to provide structural support and to help prevent electrical shorting between conductive materials and the components. The shielding structures may include compartments formed using metal fences that surround selected components or by injection molding plastic. The shielding structures may be formed using metal foil wrapped over the components and the substrate. Electronic components may be tested using test posts or traces to identify components that are faulty. The test posts or traces may be deposited on the substrate and may be used to convey test signals between test equipment and the components. After successful testing, the test posts may be permanently shielded. Alternatively, temporary shielding structures may be used to allow testing of individual components before an electronic device is fully assembled.

Description

[0001] This application claims the benefit of US Patent Application No. 13 / 488,382, filed June 4, 2012, and US Patent Application No. 61 / 495,348, filed June 9, 2011, which are hereby incorporated by reference in their entirety. technical field [0002] The present disclosure relates generally to radio frequency interference mitigation, and more particularly to electromagnetic shielding structures that help isolate radio frequency circuits from radio frequency interference. Background technique [0003] Electronic devices such as computers, cellular phones, and other devices often contain circuits that require electromagnetic shielding. For example, some electronic equipment includes radio frequency transceiver circuitry that is susceptible to radio frequency interference. Electronic devices may also include memory and other components that use the clock signal during normal operation. If care is not taken, signals from one circuit may interfere with the normal operation of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K9/00
CPCH01L2924/14H01L2924/15192H01L25/0655H01L2924/0002H01L2924/19105H01L2924/1815H05K1/0218H05K9/0043H01L2924/19043H01L2924/19041H01L23/552H05K9/0026H01L2924/3025Y10T29/49146Y10T29/4913Y10T29/49004H05K9/0031H05K9/0024H01L2924/00H05K1/02H05K9/00H05K9/0037H05K9/0033H05K9/003
Inventor 詹姆斯·H·福斯特詹姆斯·W·比兰斯基A·塞勒希R·坎德若塞哈尼古拉丝·U·韦博
Owner APPLE INC
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